首页> 外国专利> SEALING JOINT PERFORMANCE EVALUATION DEVICE, MANUFACTURING METHOD FOR SEALING JOINT PERFORMANCE EVALUATION DEVICE, SEALING JOINT PERFORMANCE EVALUATION METHOD AND SEALING JOINT PERFORMANCE EVALUATION SYSTEM

SEALING JOINT PERFORMANCE EVALUATION DEVICE, MANUFACTURING METHOD FOR SEALING JOINT PERFORMANCE EVALUATION DEVICE, SEALING JOINT PERFORMANCE EVALUATION METHOD AND SEALING JOINT PERFORMANCE EVALUATION SYSTEM

机译:密封接头性能评估装置,密封接头性能评估装置的制造方法,密封接头性能评估方法和密封接头性能评估系统

摘要

PROBLEM TO BE SOLVED: To easily evaluate sealing performance of sealing joint.;SOLUTION: The sealing joint performance evaluation device is provided with a frame part 4 having an opening 3; a plurality of vibration bodies 5a, 5b, 5c supported in the opening 3 of the frame part 4; a light-transmitting cap part 6 formed on an upper surface of the frame part 4; and a silicon substrate 7 joined to a lower surface of the frame part 4. The opening 3 is air-tightly sealed by the cap part 6 and the silicon substrate 7. Further, the vibration bodies 5a, 5b, 5c are vibrated, the vibration bodies 5a, 5b, 5c are irradiated with a light through the cap part 6, and the light reflected in the vibration bodies 5a, 5b, 5c is received. Resonance characteristic of the vibration bodies is measured from the received light, and a vacuum degree in the opening 3 is calculated from the measured resonance characteristic.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:为了容易地评估密封接头的密封性能。解决方案:密封接头性能评估装置设置有具有开口3的框架部件4;以及具有开口3的框架部件4。多个振动体5a,5b,5c支撑在框架部4的开口3中。在框部4的上表面形成有透光帽部6。框体4的下表面与硅基板7接合。开口3被盖部6和硅基板7气密地密封。另外,振动体5a,5b,5c振动,从而振动。穿过盖部6向主体5a,5b,5c照射光,并且接收在振动体5a,5b,5c中反射的光。根据接收到的光测量振动体的共振特性,并根据所测得的共振特性计算出开口3中的真空度。版权所有:(C)2008,日本特许会计师事务所

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