烷基硫醇自组装铜镀层及其树脂基复合材料界面性能研究

摘要

为改善金属转移法制备的铜镀层与碳纤维增强氰酸酯树脂基复合材料的界面粘附性能, 选用4种烷基硫醇偶联剂自组装膜 (SAMs)改性铜镀层.通过表征改性前后镀层表面形貌、表面极性变化、烷基硫醇与铜镀层之间的化学键合情况, 研究不同烷基硫醇对铜镀层与复合材料界面结合强度的影响.结果表明:4种烷基硫醇不同程度地提高了铜镀层与复合材料的界面结合强度, 具有反应活性基团和长链结构的11巯基-十一烷酸 (MUA)和11巯基-十一烷醇 (MUOL)因与复合材料产生化学键连接和分子链缠结作用, 形成铜镀层-SAM-复合材料的界面结构, 使界面结合强度提高超过70％.%To improve the adhesion strength between copper coatings and cyanate ester resin composites fabricated by metal transfer, self-assembled monolayers (SAMs)of four alkylthiols as adhesion promoters were prepared on copper coatings. Effects of different active end groups and chain lengths on adhesion strength were studied and characterized with the help of SEM, contact angle, and FT-IR et al. The results indicated that, all the four alkylthiols contributed to the adhesion enhancement of copper/CFRP and better enhancements (70％)were achieved by alkylthiols (11-Mercapto-undecanoic acid and 11-Mercapto-1-undecanol)with reactive end groups and long chains due to improved interfacial chemical linkage and entanglement of long molecular chains. The formation of Cu-SAM-CFRP and chain entanglement was essential to increase the adhesion strength between copper coatings and CFRP.