首页> 中文期刊> 《材料导报》 >环氧胶粘剂及其胶接界面热氧老化机理研究

环氧胶粘剂及其胶接界面热氧老化机理研究

             

摘要

The thermal-oxidative aging mechanism of epoxy adhesive was studied by infrared spectroscopy,X-ray photoelectron spectroscopy and scanning electron microscope.The mechanical property of epoxy adhesive joint was tested and the effect of thermal oxygen environment on its mechanical property decrease was analyzed.Experimental results showed the main chemical reactions of epoxy adhesive during accelerated thermal aging were post cure reaction and oxidation reaction.During thermal aging,the OH group of epoxy adhesive was oxidized to aldehyde group,methylene was oxidized to amide.The mechanical properties of epoxy adhesive after thermal aging showed good resistance to aging,the adhesive strength was relatively stable as aging time lasted.%采用红外光谱、X射线光电子能谱和扫描电镜对环氧胶粘剂的热氧老化机理进行了研究.同时,对环氧胶接结构进行了力学性能分析,研究了热氧环境对其力学性能退化的影响.结果表明,环氧胶粘剂在热氧加速老化中发生的化学反应主要有后固化反应和氧化反应.热氧老化过程中,环氧胶中的羟基被氧化为醛基化合物,亚甲基被氧化为酰胺.热氧加速老化后的力学性能表明,环氧胶材料本体的耐老化性能好,界面粘接强度具有较好的稳定性.

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