基于印制电路连接器变形问题的分析和设计改进

摘要

For the typical pedestal deformation problem of the mainstream 1.905mm×1.905mm contact pitch printed circuit connector, the causes of deformation were analyzed.The current technical process status was discussed, and the direction and goal of product design improvement were clarified.The optimization design was proposed from the selection of polymer materials, pedestal structure, stamping structure and glue potting function, and their analysis and verification were carried out.It provides a reference for the design of printed circuit connectors like slender structures.%针对主流1.905mm×1.905mm接点间距印制电路连接器典型规格基座变形问题, 分析了导致变形的原因, 论述了目前面临的技术工艺现状, 从而明确了产品设计改进的方向和目标.从基座高分子材料的选用、基座结构、冲压配合结构、胶液灌封功能等方面提出了优化设计, 并进行了分析验证.为后续类似细长型结构的印制电路连接器设计提供了参考.