非比例加载下电镀铜箔的晶粒长大行为

摘要

Grain growth behavior in a copper foil under nonproportional loading was investigated. The grain growth density decreased with increasing phase shift between normal stress and shear stress. Moreover, under this condition, grains tended to grow in various directions. However, the relative frequency of the grain growth direction was slightly large in the maximum shear stress direction. Therefore, grain growth density is mainly dominated by the equivalent shear stress in Tresca theory in the case of nonproportional loading as well as proportional loading.