Micro channel of T2 copper were molding through electronic-magnetic forming experiments.Laser scanning confocal microscope and contourgraph were used to measure the section profile and sheet thickness.The effects of voltage,shape of channel and discharge cycles on laws of metal flow were studied.Results showed that forming depth of micro channel and thinning of sheet thickness increased as the increasing of the voltage.Mold-filling capacity of components formed by two molds with different structures had been increased when the voltage was increased.Mold with semicircle structure facilitate the material flow and the forming depth of parts was relative large.Semicircle structure was better than taper structure in mold-filling capacity.A number of small pulse discharges can improve the forming quality and deformation,but local thinning in sheet metal leads to non-uniform distribution of thickness.
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机译:Excellent formability (成形 性), forming after high artificial aging curing (人工 时效 硬化 性), high strength, low yield ratio (降 伏 比) and high ductility (延性) and with aspects rivers sheet (雨 相 钢 sheet) manufacturing How to