考虑损伤效应的无铅焊锡材料的率相关本构模型

摘要

In this paper, the damage effect was considered into the impact process of lead-free solder specimens. Based on the experimental data, the modified rate-dependent Johnson-Cook model for the Sn3.OAgO.5Cu and Sn3. 5Ag lead-free solders were derived. The stress-strain curves obtained from the modified Johnson-Cook material models and the experiments agreed quite well with each other. It indicates that presented modified Johnson-Cook models are suitable to describe the dynamic behavior of the two lead-free solder materials.%考虑冲击过程中无铅焊锡材料试件中的损伤影响,根据实验数据确定了损伤演化参数,对原模型进行了修正,给出了Sn3.0Ag0.5Cu和Sn3.5Ag两种无铅焊锡材料考虑损伤效应的率相关本构模型.结果表明,修正后的模型与实验结果吻合较好.