一种具有滞回功能的低成本低功耗过热保护电路

摘要

A novel thermal-shutdown circuit with hysteresis was presented in this paper using 0.35 μm BCD technology. This circuit is simulated by Cadence Spectre. The simulation results show that the plus temperature is about 155 ℃ and the minus one is about 100°C under 5 V supply. Meanwhile, the power dissipation is about 0.3mW. Compared with traditional OTP circuit, the circuit in this paper has lower power dissipation and smaller layout area.%　　给出了采用0.35μm BCD工艺设计具有热滞回功能的过热保护电路的具体方法,并利用Cadence Spectre仿真工具对电路进行了仿真.结果表明：在5 V的工作电压下,其过热温度点为155℃,负向温度为100℃,在27℃时的功耗约为0.3 mW.与传统过热保护电路相比,该电路具有功耗低、版图面积小等优点.