基于三维噪声模型的非制冷红外焦平面读出电路的分析

摘要

基于3D噪声模型对非制冷红外读出电路噪声产生的原因进行分析,重点阐述了三维噪声的理论框架与分析方法,分析各噪声因子的含义以及产生原因,并给出计算方法,对读出电路各种噪声分量的产生进行了深入的分析.并基于此模型对阵列大小为320×240非制冷红外焦平面阵列进行分析,计算出各噪声因子的大小,得出了噪声产生的主要原因,为焦平面阵列性能的提高与评估提供了理论依据.%This article focuses on the analysis method and theoretical framework of the 3-D noise technology. The implications of various noise components are analyzed with the calculation methods given. The reasons of noise generation are analyzed in details. In this paper, the UIRFPA consisting of 320×240 detectors was tested by using three-dimension noise model. By using this method, the cause of the noise can be obtained, providing a reference for designing and evaluation of thermal imaging system.