电阻法探究喷铸温度对Zr57Cu20Al10Ni8Ag5非晶热稳定性及结构弛豫的影响

摘要

The rectangular blocks of Zr57Cu20Al10Ni8Ag5 bulk metallic glass (BMG) were manufactured by injecting the melt into copper mold. Influence of injecting temperatures of Zr57Cu20Al10Ni8Ag5 BMG on thermal stability and structure relaxation was studied by electrical resistivity measurement. The results show that increasing the injecting temperature leads to the increase of Tx and the enlargement of supercooled region ΔT, indicating the improved thermal stability. Moreover, the structure relaxation at low temperature is explored by electrical resistivity measurement. An abnormal change " inflexion" could be observed in the reduced electrical resistance curve. And with elevating the injecting temperature, " inflexion" occurs at lower temperature and its intensity is enhanced.%采用铜模喷铸法制备出Zr57Cu20Al10Ni8Ag5大块金属玻璃,通过电阻法探究喷铸温度对其热稳定性及结构弛豫的影响.结果表明,提高该金属玻璃制备时的喷铸温度,使晶化转变点Tx明显滞后和过冷液相区ΔT增大,表明金属玻璃热稳定性增强.此外,运用电阻法研究了金属玻璃在低温下的结构弛豫,发现约化电阻率曲线存在"拐点"的异常变化.随着喷铸温度的升高,"拐点"的开始温度点Tonset提前,且金属玻璃结构弛豫强度增强.