The structure, fabrication and emission characteristics of a silicon cold micro-cathode using ultra-shallow PN+ junction are presented. Implantation of As+ with a energy around 12 kev, rapid thermal annealing combined with argon sputtering are used for forming ultra-shallow pn+ junction, whose depth is lower than 30nm. In a vacuum system Ⅰ-Ⅴcharacteristics were measured. The stability problem which was found in the devices testing is also discussed in this paper.
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机译:利用扫描穿隧显微镜探讨在硒化铟上未氧化表面和氧化表面之介面接合处的电子特性 =Scanning Tunneling Microscope study of InSe Surface Electronic Properties at the Fresh/Oxided Interface Junction