首页> 中文期刊> 《材料科学技术:英文版》 >Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys

Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys

         

摘要

The immiscible Cu-Fe alloy was characterized by a metastable miscibility gap.With the addition element Zr,the miscibility gap can be extended into the Cu-Fe-Zr ternary system.The effect of the atomic ratio of Cu to Fe and Zr content on the behavior of liquid-liquid phase separation was studied.The results show that liquid-liquid phase separation into Cu-rich and Fe-rich liquids took place in the as-quenched Cu-Fe-Zr alloy.A glassy structure with nanoscale phase separation was obtained in the as-quenched(Cu0.5Fe0.5)40Zr60 alloy sample,exhibiting a homogeneous distribution of glassy Cu-rich nanoparticles in glassy Fe-rich matrix.The microstructural evolution and the competitive mechanism of phase formation in the rapidly solidified Cu-Fe-Zr system were discussed in detail.Moreover,the electrical property of the as-quenched Cu-Fe-Zr alloy samples was examined.It displays an abnormal change of electrical resistivity upon temperature in the nanoscale-phase-separation metallic glass.The crystallization behavior of such metallic glass has been discussed.

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