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Two-stage Hall-Petch relationship in Cu with recrystallized structure

         

摘要

Although Cu was studied extensively,the Hall-Petch relationship was mainly reported in the coarsegrained regime.In this work,fully recrystallized Cu specimens with a wide grain size regime of 0.51–14.93μm manifest a two-stage Hall-Petch relationship.There is a critical grain size of 3μm that divides stagesⅠandⅡwhere the Hall-Petch slope k value are quite different.The stageⅡis supposed to be validified down to 100 nm at least by comparing with a Cu-Ag alloy.The critical grain size varies in different materials systems,and the underline mechanisms are discussed based on the dislocation glide modes.

著录项

  • 来源
    《材料科学技术:英文版》 |2020年第13期|31-35|共5页
  • 作者单位

    Key Laboratory for Anisotropy and Texture of Materials(Ministry of Education);

    School of Materials Science and Engineering;

    Northeastern University;

    Shenyang 110819;

    China;

    State Key Laboratory of Rolling and Automation;

    Northeastern University;

    Shenyang 110819;

    China;

    Department of Materials Science and Engineering;

    Kyoto University;

    Yoshida-honmachi;

    Sakyo-ku;

    Kyoto 606-8501;

    Japan;

    Elements Strategy Initiative for Structural Materials(ESISM);

    Kyoto University;

    Yoshida-honmachi;

    Sakyo-ku;

    Kyoto;

    606-8501;

    Japan;

    Key Laboratory of Aerospace Advanced Materials and Performance of Ministry of Education;

    School of Materials Science and Engineering;

    Beihang University;

    Beijing 100191;

    China;

    State Grid Urban and Rural Electric Power Design Research(Beijing)Co.Ltd;

    Beijing 100078;

    China;

    Laboratory of Fatigue and Fracture for Materials;

    Institute of Metal Research;

    Chinese Academy of Sciences;

    Shenyang 110016;

    China;

    School of Materials Science and Engineering;

    University of Science and Technology of China;

    Hefei 230026;

    China;

  • 原文格式 PDF
  • 正文语种 chi
  • 中图分类 TG146.11;
  • 关键词

    Cu; Yield strength; Hall-Petch relationship; Ultrafine grain; Recrystallization;

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