Orientation dependence of mechanically induced grain boundary migration in nano-grained copper

摘要

Tensile tests were carried out on gradient nanograined copper samples to investigate the grain orientation dependence of mechanically induced grain boundary migration(GBM) process. The relationship between GBM and the orientations of nanograins relative to loading direction was established by using electron backscatter diffraction. GBM is found to be more pronounced in the grains with higher Schmid factors where dislocations are easier to slip. As a result, the fraction of high angle grain boundaries decreases and that of low angle grain boundaries increases after GBM.