基于多信号流模型的模型封装与解包技术

摘要

随着科技的快速发展,设备系统的复杂程度越来越高,多信号流模型是系统测试性分析的常用模型,为解决复杂系统建模分析时对其各分系统信息保密问题,提出了一种基于多信号流模型的模型封装与解包方法.该方法首先确定了封装模块数据信息并实现封装,然后构建封装模块测试信息描述表,描述了封装模块内部故障、内部测试与外部信息的关系以及封装模块本身对外部信息的影响,实现了模块的解包.实验表明,该描述方法可以有效地屏蔽了被封装的分系统模型的技术信息,有利于各分系统设计者之间的信息保密,同时利用该描述方法,还可以有效地减少测试性分析所需的时间.%With the fast development of the technology, the device system gets more and more complex. And multi-signal flow graph is a common model for system testability analysis, A module encapsulation and unpacked method based on the multi-signal flow graph is provid-ed for solving the sub-systems technical security problems. In the method, firstly an encapsulated module data information is determined and encapsulated, then an encapsulation module testability information table is constructed, describing the influence of the encapsulation module to the external information and the relationship between the inter faults as well as the inter tests of the encapsulation module and the external information. The unpacked is accomplished. The results of the tests show that the describing method can effectively shield the technical in-formation of the encapsulated sub-system modules, and reduce the testability analysis time.