潜伏性2MMZ-PS微胶囊固化剂的制备与表征

摘要

以2-甲基咪唑(2MMZ)为芯材,聚苯乙烯(PS)为壁材,采用溶剂挥发技术,制备了一种新型潜伏性2MMZ-PS微胶囊固化剂.通过红外光谱仪(FT-IR)、热重分析仪(TGA)、扫描电子显微镜(SEM)、粒度分析仪和差热扫描量热仪(DSC)对微胶囊固化剂的化学结构、芯材含量、表面形貌、粒径分布及固化性能等进行了表征.所制备的微胶囊固化剂表面光滑,粒径分布较窄,平均粒径约为10.18 μm,芯材2MMZ含量为40.36％.由微胶囊固化剂与环氧树脂E-51制备的单组分胶黏剂,具有优良的固化特性和潜伏性能,可在100℃下1h内实现固化,室温储存期可达1个月以上.%A novel heat released microcapsule-type latent curing agent was prepared by solvent evaporation technique with 2-methylimidazole (2MMZ) as core material and polystyrene (PS) as wall material. The chemical structure, core material content, surface morphology, size distribution and curing characteristics of this microcapsule-type curing agent were characterized by FT-IR, TGA, SEM, granulometer and DSC. The obtained microcapsules had a smooth surface and displayed a narrow size distribution with the mean size about 10.18 f*m, and its core material content was about 40. 36%. In addition, the one-component adhesive made from the microcapsules and epoxy resin E-51 showed excellent curing characteristics and latent properties. It was found that the E-51/2MMZ-PS microcapsule system could be cured at 100 °C in 1 h and its shelf life at room temperature was more than 1 month.