针对铝电解用金属陶瓷惰性阳极材料与金属导杆的电连接困难问题,以Al(H2PO4)3为胶粘剂,CuO为固化剂,NiFe2O4陶瓷粉和Cu-Ag合金粉为填充料,连接NiFe2O4基金属陶瓷.通过分析Al(H2PO4)3与CuO的反应过程,观察磷酸盐连接NiFe2O4基金属陶瓷的界面形貌,探索其高温连接机理.结果表明:Al(H2PO4)3与CuO反应后生成的Cu-P-O化合物是主要连接物相;Cu-P-O化合物随温度的变化逐步发生一系列物相变化,并在960~1 000℃下逐步分解为CuO和P2O5;在不同热处理温度下,磷酸盐与NiFe2O4基金属陶瓷连接界面始终保持紧密结合状态:低温下连接层与金属陶瓷润湿性良好并依靠吸附作用相互连接,高温下连接层与金属陶瓷依靠互扩散作用相互连接.%The electrical bonding of inert anode cermet with metal was hard to solve. A phosphate bonding technology of NiFe2O4 cermet was explored using Al(H2PO4)3 as adhesive, CuO as curing agent, NiFe2O4 ceramic powder and Cu-Ag alloy powder as filler. The reaction process of Al(H2PO4)3 and CuO was analyzed. The microstructures of bonding interface were investigated. The bonding mechanism was studied. The results show that the main bonding phase are Cu-P-O compounds, the reaction product of Al(H2PO4)3 and CuO at different temperatures. The Cu-P-O compounds reveal different crystal structures at different temperatures, and decompose into CuO and P2O5 at temperature range of 960-1 000 ℃. The phosphate and NiFe2O4 cermet bonding interface remains closely connected state at different heat-treated temperatures. At low temperature, the wetting property is good between cermet and phosphate bonding phase. And the cermet and bonding layer rely on the adsorption capacity to connect each other. At high temperature, the cermet and bonding layer rely on the diffusion to connect each other.
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