＜正＞ Bonding with adhesives is an important technique for building up hybrid microsystems.Some adhesives are tested with capillary dispensing system for microassembly, and volume of dropletsless than 10 nl with good repeatability can be acquired. 1-part UV curing adhesive hardens rapidly andis suitable for bonding of transparent microparts. Light-activated adhesive starts the curing process inan adjustable short period of time after the radiation of visible light, and thus suits bonding ofnon-transoarent microparts. A method is proposed for bonding the guides of a miniature linear motorbeing developed by collaborate research center 516 （SFB516） in Germany.With the method high as-sembly accuracy in the vedical direction can be guaranteed. By making small grooves on the stator forcontaining adhesive, the deterioration of the accuracy due to the thickness of adhesive layer can beavoided. The criteria on deciding the size of the groove are given and analyzed. Vision based inspec-tion method is introduced for aut
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