Heat dissipation of high-power LED is the main bottleneck for its application. In order to better solve the heat dissipation problem, a new cold spray technology is applied to deposit thin copper coating which can make the soldering of LED head with heat sink possible, and this can significantly extend the durability of high-power LED lamp when comparing with current high-power LED lamp using crimped connection with thermal interface material, also can decrease the thermal contact resistance. Better heat dissipation performance of high-power LED has been verified by CAE software simulation and experiments. And with the increase of input power for LED lamps, the temperature difference of the LED chip between soldering and crimping structure also increases, the cooling effect of soldering is more significant. However, at present the thermal conductivity of the copper layer by cold spray is only 160 W/(m·K) , which has a great gap with the conventional copper's thermal conductivity 398 W/(m·K) ,so the cold spray process needs to be further improved.
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