Analytical models for passive linear structures, like metallic traces, vias, are proposed for simulations at the package and Printed circuit board（PCB） levels. In the proposed method, traces are modeled based on the transmission line theory, whereas the vias are described by the parallel-plate impedance and several equivalent circuits elements. The proposed models can be applied to efficiently simulate composed passive linear structures. Several scenarios are analyzed including traces with two or three width, traces routed into different layers and interconnects commonly used in PCBs. The results of the models are compared with those from the fullwave simulations and experiments. An improvement on the computation speed has been observed with respect to the full-wave simulations at the effective range of models. In our measurements, a compensation approach of impedance mismatch in parameter measurements is analyzed and calculated, which could significantly simplify the experimental process.
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