首页> 外文期刊>中国林业科技:英文版 >Research Status and Prospect of Binderless Board
【24h】

Research Status and Prospect of Binderless Board

机译:合体板的研究现状与展望

获取原文
获取原文并翻译 | 示例
       

摘要

The latest research progress of binderless board was summarized in the view of the existing binderless technology at home and abroad,and according to the bonding mechanism of binderless board,the problems an d questions in its manufacture and application at present were summed up,at last,the effect of bindless board forming process on the development of artificial board industry in China was prospected.
机译:在国内外的现有合体技术的角度来看,粘合剂委员会的最新研究进展总结了,并根据粘合剂委员会的粘接机制,终于概括了其制造和应用中的D问题的问题展望了戒断板形成过程对中国人工板行业发展的影响。

著录项

获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号