School of Materials Science and Engineering, Shanghai University, Shanghai 200072, China;
School of Mechanical Engineering,Shandong University, Jinan 250061, China;
School of Materials Science and Engineering, Shanghai University, Shanghai 200072, China;
School of Materials Science and Engineering, Shanghai University, Shanghai 200072, China;
School of Materials Science and Engineering, Shanghai University, Shanghai 200072, China;
School of Materials Science and Engineering, Shanghai University, Shanghai 200072, China;
pure copper; pulse magnetic field; solidification structure; property;