采用凝胶注模成型工艺制备出了具有低介电常数和高强度特性的多孔Si<,3>N<,4>陶瓷平板和锥形体样件,并对其微观结构、高温介电性能、透波率和弯曲强度等进行了测试与分析.结果表明:该方法获得的多孔Si<,3>N<,4>陶瓷具有低介电常数(2.3-2.8)、高弯曲强度(大于50 MPa)、高温介电性能稳定和透波率良好等优点.%In order to meet the requirement for wave-transparent materials, the porous Si3N4 materials with high strength and low dielectric constant were fabricated by gel-casting method. The microstructure, dielectric properties,wave transmittance and flexural strength were investigated. The results show that the flexural strength of porous Si3N4 is up to 50 MPa with dielectric constant of 2. 3 to 2. 8. At the same time, the materials have steady high temperature dielectric properties and good wave-transparent properties.
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