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Process development of contact and functional layers for novel semiconductors.

机译:用于新型半导体的接触层和功能层的工艺开发。

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摘要

This study is focused on process development regarding Ohmic and Schottky contacts to n-ZnO and the application of functional layers to GaN and InN nanostructures for Hydrogen sensing. Goals of this work are three fold: first is to develop low resistance contacts for n-ZnO with higher thermal stability than typical metal stacks. Second, cryogenic temperatures have been used to deposit metal contacts to n-ZnO in order to increase barrier height at the interface for improved Schottky behavior. Finally, metal functionalization layers of Pt or Pd have been attempted on GaN nanowires and InN nanobelts for Hydrogen sensing.;Ohmic contacts to n-ZnO were fabricated using a variety of robust, refractory materials including TiB2, CrB2, and Ir. Boride contacts were rectifying for lower anneal temperatures but transition to Ohmic behavior at higher temperatures (700°C) and exhibit minimum specific contact resistivity as low as ∼5x10-4 O. cm. Higher temperatures led to severe contact metallurgy intermixing and an increase in specific contact resistivity. Ir contacts exhibited high thermal stability and minimum specific contact resistance of 3.6x10-5 O.cm2 after a 1000°C anneal.;Next, the effect of cryogenic temperatures during deposition of Pd, Pt, Ti, Ni, and Au on n-ZnO was investigated. Deposition at both room and low temperature produced contacts with Ohmic characteristics for Ti and Ni metallizations. By sharp contrast, both Pd and Pt contacts showed rectifying characteristics after deposition with barrier heights between 0.37--0.69 eV. Pd contacts showed an increase in barrier height along with a decrease in ideality factor with increasing annealing temperature. Au deposited at room temperature produced contacts with Ohmic characteristics while cryogenic deposition produced rectifying characteristics. The differences in contact behavior were stable to anneal temperatures of ∼300°C.;Finally, Pd and Pt functionalization layers were deposited to GaN nanowires and InN nanobelts for Hydrogen sensing. Both uncoated nanomaterials show little or no current response upon exposure to hydrogen gas. The addition of a functional layer is shown to dramatically affect response to H2, allowing for hydrogen to be detected down to the hundreds of ppm level. Pd exhibits a greater response to hydrogen than Pt in both cases.
机译:这项研究的重点是与n-ZnO的欧姆和肖特基接触有关的工艺开发,以及将功能层应用于GaN和InN纳米结构进行氢感测的过程。这项工作的目标有三方面:首先是为n-ZnO开发低电阻触点,该触点具有比典型金属堆叠更高的热稳定性。第二,为了增加肖特基行为,已使用低温将金属触点沉积到n-ZnO上,以增加界面处的势垒高度。最后,已在GaN纳米线上和InN纳米带上尝试了Pt或Pd的金属功能化层以进行氢感测;使用多种坚固的耐火材料(包括TiB2,CrB2和Ir)制造了与n-ZnO的欧姆接触。硼化物触点在较低的退火温度下可进行整流,但在较高温度(700°C)时转变为欧姆行为,并表现出最低的比电阻率低至约5x10-4 O. cm。较高的温度导致严重的接触冶金混合和比接触电阻率增加。 Ir触点在1000°C退火后表现出高的热稳定性和3.6x10-5 O.cm2的最小比电阻;其次,Pd,Pt,Ti,Ni和Au沉积期间低温对n-的影响研究了ZnO。在室温和低温下沉积都会产生具有欧姆特性的Ti和Ni金属化接触。与之形成鲜明对比的是,Pd和Pt触点在沉积后均显示整流特性,势垒高度在0.37--0.69 eV之间。 Pd触点随着退火温度的升高,势垒高度增加,而理想因子降低。在室温下沉积的金产生具有欧姆特性的接触,而低温沉积则产生整流特性。接触行为的差异在约300°C的退火温度下稳定;最后,将Pd和Pt功能化层沉积到GaN纳米线和InN纳米带上进行氢感测。两种未涂覆的纳米材料在暴露于氢气时都几乎没有电流响应。已显示,添加功能层会极大地影响对H2的响应,从而可以检测出低至数百ppm的氢。在两种情况下,Pd对氢的反应都比Pt大。

著录项

  • 作者

    Wright, Jonathan.;

  • 作者单位

    University of Florida.;

  • 授予单位 University of Florida.;
  • 学科 Materials science.
  • 学位 Ph.D.
  • 年度 2009
  • 页码 128 p.
  • 总页数 128
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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