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Distributed decap-padded standard cell based on-chip voltage drop compensation framework.

机译:基于片上压降补偿框架的分布式去盖填充标准单元。

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摘要

Technology induced voltage scaling coupled with faster switching, have made the circuit behavior very sensitive to the power supply variations. The effect is classified as power and ground bounce problems. Power and ground bounce can inject random glitches which propagate as mal-functioning logic.;On-chip decoupling capacitors (Decap) are used to reduce the power supply noise. Traditionally, lumped decaps are placed in the chip-finishing stages at available white spaces. However, insufficient budgeting at an early stage and lack of placement estimation have often positioned the decaps at a distance away from the switching nodes. Experimental results show that proximity of the decaps to the violating switching nodes is more effective in power supply noise cancellation. This work attempts to develop an alternative framework to incorporate the decaps in a design close to the switching nodes, thus making them more effective.;The proposed voltage drop optimization framework comprises of three components. First, a special standard cell library with minimum decap padding is developed in order to place decaps closest to the victim nodes. Second, we propose an optimization algorithm to incorporate these standard cells together with minimal value of lumped decaps in the physical synthesis stages. Lastly, we develop an engineering change order placer to generate a valid decap-optimized placement. The developed framework is integrated with the commercial backend design tools (Cadence and Synopsys). The effectiveness of our work has been demonstrated on standard benchmark circuits.
机译:技术引起的电压缩放和更快的开关速度,已使电路行为对电源变化非常敏感。这种影响被归类为电源和地面反弹问题。电源和接地反弹会注入随机毛刺,这些毛刺会作为故障逻辑而传播。片上去耦电容器(Decap)用于降低电源噪声。传统上,集总的盖头被放置在芯片加工阶段的可用空白处。然而,早期的预算不足和放置估计的缺乏经常使摘帽定位在距交换节点一定距离的位置。实验结果表明,去电容器接近违规的开关节点在消除电源噪声方面更为有效。这项工作试图开发一种替代框架,以将decaps包含在靠近开关节点的设计中,从而使它们更有效。拟议的电压降优化框架包括三个组件。首先,开发了具有最小去盖填充的特殊标准单元库,以将去盖放置在最靠近受害节点的位置。其次,我们提出了一种优化算法,将这些标准单元与物理合成阶段中集总的开端的最小值合并在一起。最后,我们开发了一个工程变更单放置程序,以生成有效的经过优化的放置位置。开发的框架与商业后端设计工具(Cadence和Synopsys)集成在一起。我们的工作效果已经在标准基准电路上得到了证明。

著录项

  • 作者

    Johari, Pritesh.;

  • 作者单位

    University of Cincinnati.;

  • 授予单位 University of Cincinnati.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 M.S.
  • 年度 2009
  • 页码 152 p.
  • 总页数 152
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

  • 入库时间 2022-08-17 11:38:27

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