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Non-contact characterization of dielectric conduction on 4H-silicon carbide.

机译:4H-碳化硅上介电传导的非接触特性。

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摘要

Consistent charge or defect control in oxide grown on silicon carbide (SiC) continues to be difficult to achieve and directly impacts the electrical performance of SiC-based metal oxide semiconductor (MOS) devices. This research applied non-contact Corona-Kelvin metrology to investigate the charge transport in oxides grown on n-type 4H-SiC epitaxial substrates. The cost and engineering science impact of this metrology are significant as device fabrication is avoided leading to quick determination of electrical characteristics from as-grown oxide films. Non-contact current-voltage (I-V) measurements of oxide on SiC were first demonstrated within this work and revealed that Fowler-Nordheim (F-N) current emission was the dominant conduction mechanism at high electric fields.;Oxides on SiC were grown at atmospheric pressure (thermal oxides) or at a reduced pressure (afterglow oxides) ambient and examined using non-contact charge-voltage (Q-V), capacitance-voltage (C-V), equivalent oxide thickness (EOT), and I-V methods. The F-N conduction model was modified to address charge trapping and effective barrier effects obtained from experimental oxide films. Trap densities determined with this metrology were used to show that the F-N model including their density and position was adequate for thermal oxides on SiC but not for afterglow films. Data from the latter films required further modification of the theory to include a chemical effect of the oxide growth process on the effective conduction band offset or barrier. This work showed that afterglow chemistry was able to vary the effective conduction band offset from 2.9 eV, typical of thermal oxidation of SiC, up to 3.2 eV.;Stress induced leakage current (SILC), an excess above the F-N base current resulting from prolonged current through the dielectric films, was also investigated. Multiple point SILC testing was used to identify statistical effects of process variations and defects in as-grown oxide films on SiC. These results open the possibility to improve oxide manufacture on SiC using methods common in the silicon IC industry. This work demonstrated the first non-contact F-N current determination in oxides on SiC and showed both charge trapping and chemical dependencies of as-grown films. Future studies may extend the findings of this work to further improve this important dielectric-semiconductor system.
机译:一直难以实现在碳化硅(SiC)上生长的氧化物中的一致电荷或缺陷控制,并且直接影响基于SiC的金属氧化物半导体(MOS)器件的电性能。这项研究应用非接触式Corona-Kelvin计量技术来研究在n型4H-SiC外延衬底上生长的氧化物中的电荷传输。由于避免了器件制造,从而可以快速确定所生长的氧化膜的电特性,因此这种度量的成本和工程科学意义重大。在这项工作中首次证明了氧化物在SiC上的非接触电流-电压(IV)测量,并揭示了Fowler-Nordheim(FN)电流发射是高电场下的主要传导机理。; SiC上的氧化物在大气压下生长(热氧化物)或减压(余辉氧化物)的环境中,并使用非接触电荷电压(QV),电容电压(CV),等效氧化物厚度(EOT)和IV方法进行检查。修改了F-N传导模型,以解决电荷陷阱和从实验氧化膜获得的有效势垒效应。用这种度量方法确定的陷阱密度用于显示F-N模型(包括其密度和位置)足以用于SiC上的热氧化物,但不适用于余辉膜。从后面的电影中获得的数据需要对理论进行进一步修改,以包括氧化物生长过程对有效导带偏移或势垒的化学作用。这项工作表明,余辉化学能够将有效传导带偏移从2.9 eV(通常是SiC热氧化的典型值)改变到3.2 eV .;应力引起的漏电流(SILC),由于延长而导致超出FN基极电流还研究了通过介电膜的电流。多点SILC测试用于确定SiC上生长的氧化膜的工艺变化和缺陷的统计影响。这些结果提供了使用硅IC工业中常用的方法来改进在SiC上的氧化物制造的可能性。这项工作证明了在SiC氧化物中首次非接触式F-N电流测定,并且显示了成膜薄膜的电荷俘获和化学依赖性。未来的研究可能会扩展这项工作的发现,以进一步改善这一重要的介电半导体系统。

著录项

  • 作者

    Benjamin, Helen N.;

  • 作者单位

    University of South Florida.;

  • 授予单位 University of South Florida.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2009
  • 页码 158 p.
  • 总页数 158
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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