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Experimental and numerical investigation of laser assisted milling of silicon nitride ceramics.

机译:氮化硅陶瓷激光辅助铣削的实验和数值研究。

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摘要

This study experimentally and numerically investigates laser assisted milling (LAMill) of silicon nitride ceramics. Experiments are conducted to study the machinability of Si3N4 under LAMill. The effects of temperature on cutting forces, tool wear, surface integrity, edge chipping and material removal mechanisms are investigated. It is shown that when temperature increases, cutting force and tool wear are significantly decreased, surface integrity is improved, chip size is increased and material removal demonstrates more plastic characteristics. The mechanisms of edge chipping at elevated temperature are investigated theoretically and experimentally. When temperature is above the softening point and below the brittle/ductile transition temperature, the mechanism is mainly through softening. When temperature is above the brittle/ductile transition temperature, toughening mechanism contributes significantly to the reduced edge chipping. The coupled effect of softening and toughening mechanisms shows that temperature range between 1200 to 1400°C has the most significant effect to reduce edge chipping.;Distinct element method (DEM) is applied to simulate the micro-mechanical behavior of Si3N4. First, quantitative relationships between particle level parameters and macro-properties of the bonded particle specimens are obtained, which builds a foundation for simulation of Si 3N4. Then, extensive DEM simulations are conducted to model the material removal of machining Si3N4. The simulation results demonstrate that DEM can reproduce the conceptual material removal model summarized from experimental observations, including the initiation and propagation of cracks, chip formation process and material removal mechanisms. It is shown that material removal is mainly realized by propagation of lateral cracks in machining of silicon nitride. At the elevated temperature under laser assisted machining, lateral cracks are easier to propagate to form larger machined chips, there are fewer and smaller median cracks therefore less surface/subsurface damage, and crushing-type material removal is reduced. The material removal at elevated temperature demonstrates more plastic characteristics. The numerical results agree very well with experimental observations. It shows that DEM is a promising method to model the micro-mechanical process of machining Si 3N4.
机译:这项研究在实验和数值上研究了氮化硅陶瓷的激光辅助铣削(LAMill)。进行实验以研究在LAMill下Si3N4的可切削性。研究了温度对切削力,工具磨损,表面完整性,边缘碎裂和材料去除机理的影响。结果表明,当温度升高时,切削力和刀具磨损显着降低,表面完整性得到改善,切屑尺寸增加并且材料去除表现出更多的塑性。从理论上和实验上研究了高温下边缘碎裂的机理。当温度高于软化点且低于脆/延性转变温度时,其机理主要是通过软化。当温度高于脆性/延性转变温度时,增韧机制会显着减少边缘碎裂。软化和增韧机理的耦合作用表明,温度范围在1200至1400°C范围内对减少边缘崩裂具有最显着的影响。;采用离散元方法(DEM)来模拟Si3N4的微观力学行为。首先,获得了颗粒物级参数与键合颗粒样品宏观性能之间的定量关系,为Si 3N4的模拟奠定了基础。然后,进行了广泛的DEM模拟,以模拟加工Si3N4的材料去除。仿真结果表明,DEM可以重现从实验观察总结的概念材料去除模型,包括裂纹的产生和传播,切屑形成过程和材料去除机理。结果表明,材料去除主要是通过氮化硅加工中横向裂纹的扩展来实现的。在激光辅助加工的高温下,横向裂纹更容易传播以形成较大的加工切屑,中间裂纹越来越少,因此表面/亚表面损伤更少,并且减少了破碎型材料的去除。在高温下去除材料表现出更多的塑性。数值结果与实验结果非常吻合。结果表明,DEM是模拟加工Si 3N4的微机械过程的有前途的方法。

著录项

  • 作者

    Yang, Budong.;

  • 作者单位

    Kansas State University.;

  • 授予单位 Kansas State University.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2009
  • 页码 146 p.
  • 总页数 146
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;
  • 关键词

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