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IC Design Analysis, Optimization and Reuse via Machine Learning

机译:通过机器学习进行IC设计分析,优化和重用

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摘要

Since the introduction of theMoore's law in 1965, the integrated circuit industry has successfully managed over 50 years of exponential growth in design complexity and the transistor number has grown from thousands to billions on a single chip. Electronic design automation (EDA) tools are among the biggest factors that keep this growth trend and lead to the developments of cost- and energy- efficient robust electronic circuits and systems.;As technology node continues to scale down, the traditional EDA-based design methodology is challenged from many aspects. Firstly, the growing design complexity results in a significant increase in the computational cost and human labor for conducting thorough design analysis and optimization, both of which are keys to IC design successes. Secondly, the sophisticated underlying physics of advanced technology nodes make the modeling capability of the EDA tools questionable. In fact, most of the failures observed in qualification tests are direct results from such modeling issues, examples include mistuned analog circuits, signal timing errors, reliability problems, and crosstalk. The qualification failures in fabricated chips imply additional rounds of designs, known as design respins and it requires more efficient and reliable EDA tools to design high-yield circuits and systems aiming at the maximum utilization of the new technology and potentially eliminate the need for design respins.;In this work, we demonstrate how machine learning helps to alleviate the bottlenecks mentioned above.We particularly focus on the enhancement of simulation-based methodology for efficient design analysis, modeling, optimization, and yield estimation.;The fundamental idea for incorporating machine learning into the existing simulation based design methodology is to harness the statistical models' capability of extracting information from the limited data set and make fast predictions about unobserved designs as well as accurately quantify the prediction uncertainty. The model can be used either as a direct surrogate of the expensive simulator or as a guide for the design decision-making process.;In this work, we demonstrate the efficacy of the proposed methodology through several circuit and system designs. Examples include the calibration of reliability-related degradations in mixed-signal circuits, fast configurations of the physical design flow, automatic analog circuit optimization and intellectual property (IP) reuse, and yield estimation of SRAM cells with low failure probability.
机译:自1965年采用摩尔定律以来,集成电路行业已经成功地管理了50多年的设计复杂度指数增长,并且单个芯片上的晶体管数量已从数千增加到数十亿。电子设计自动化(EDA)工具是保持这一增长趋势并导致具有成本和能源效率的稳健电子电路和系统发展的最大因素之一。随着技术节点的规模不断缩小,传统的基于EDA的设计方法论受到很多方面的挑战。首先,不断增加的设计复杂性导致进行彻底的设计分析和优化所需的计算成本和人力大量增加,这两者都是IC设计成功的关键。其次,先进技术节点的复杂基础物理特性使EDA工具的建模能力受到质疑。实际上,在资格测试中观察到的大多数故障都是此类建模问题的直接结果,示例包括模拟电路错误,信号时序误差,可靠性问题和串扰。人造芯片的鉴定失败意味着需要进行额外的设计回合,称为设计重新设计,并且它需要更有效,更可靠的EDA工具来设计高产量电路和系统,以最大程度地利用新技术,并有可能消除对设计重新设计的需求。在这项工作中,我们演示了机器学习如何帮助缓解上述瓶颈。我们特别关注增强基于仿真的方法,以进行有效的设计分析,建模,优化和产量估算。;合并机器的基本思想了解现有的基于仿真的设计方法是要利用统计模型从有限的数据集中提取信息的能力,并对未观察到的设计进行快速预测,并准确地量化预测不确定性。该模型既可以用作昂贵的仿真器的直接替代品,也可以用作设计决策过程的指南。在这项工作中,我们通过几种电路和系统设计论证了所提出方法的有效性。例子包括校准混合信号电路中与可靠性相关的性能下降,物理设计流程的快速配置,自动模拟电路优化和知识产权(IP)重用以及具有低故障概率的SRAM单元的成品率估计。

著录项

  • 作者

    Qi, Weiyi.;

  • 作者单位

    North Carolina State University.;

  • 授予单位 North Carolina State University.;
  • 学科 Electrical engineering.;Computer science.
  • 学位 Ph.D.
  • 年度 2017
  • 页码 179 p.
  • 总页数 179
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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