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Reactive sputter deposition of vanadium, nickel, and molybdenum oxide thin films for use in uncooled infrared imaging.

机译:钒,镍和氧化钼薄膜的反应溅射沉积,用于未冷却的红外成像。

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摘要

A vanadium oxide (VOx) thin film is the most common imaging layer used in commercial uncooled focal plane arrays for infrared cameras. These VOx thin films have an x value ranging from 1.3 to 2 and have low resistivity (0.1 to 10 O·cm), high temperature coefficient of resistance (TCR) (--2 to --3 %/K), and low 1/f noise. Reactive ion beam sputtering is typically used to deposit these VOx thin films for commercial thermal imaging cameras. However, the reactive ion beam deposition system for the VOx is reported to have less than desirable throughput and a narrow process window.;In this work, the potential for reactive pulsed-dc magnetron sputtering of nanocomposite VOx thin films for microbolometer applications was investigated. VOx thin films with resistivity from 10 -4 to 105 O·cm with a TCR from 0 to -4.3 %/K were deposited by reactive sputtering from a metallic vanadium target in argon/oxygen mixtures with substrate bias. Magnetron sputtered VO x shows bolometric properties comparable to those of commercial-grade IBD prepared VOx. Important limitations for manufacturing implementation of reactive magnetron sputtering such as hysteresis oxidation and non-uniform oxidation of the vanadium target surface were evaluated. The VOx film deposition rate, resistivity, and temperature coefficient of resistance were correlated to oxygen to argon ratio, processing pressure, target-to-substrate distance, and oxygen inlet positions. To deposit VOx in the resistivity range of 0.1--10 O·cm with good uniformity and process control, it was found that a lower processing pressure, larger target-to-substrate distance, and an oxygen inlet near the substrate are useful. Other processing methods employing magnetron sputtering were investigated such as co-sputtering of V and V2O5 target, sputtering from a VC target, a V2O5 target, and a V2Ox target but initial investigation of these methods did not yield a superior process to the simple sputtering of a pure metallic vanadium target.;Another technique, biased target ion beam deposition (BTIBD), was investigated for deposition VOx thin films with potential alloy additions. In this BTIBD system, ions with energy lower than 25 eV were generated remotely and vanadium targets are negatively biased independently for sputtering. High TCR (<-4.5%/K) VOx thin films have been reproducibly prepared in the resistivity range of 103-104 O·cm by controlling the oxygen partial pressure using real-time control with a residual gas analyzer. These high resistivity films may be useful in next generation uncooled focal plane arrays for through-film rather than lateral thermal resistors. This architecture could improve the sensitivity through the higher TCR without increasing noise normally accompanied by higher resistance. Processing parameters necessary to produce high TCR VOx films and details on how this novel deposition tool operates are discussed. Addition of molybdenum and its effects on the VOx thin films' electrical properties were also studied.;Using the BTIBD system, VOx films in the resistivity range of 0.1-10 O·cm desired for current microbolometer application were difficult to produce. Pure molybdenum oxide (MoOx) and nickel oxide (NiOx) thin films were deposited by reactive biased target ion beam deposition and evaluated in a search for materials with a larger process latitude. MoOx thin films were deposited with resistivity from 3 to 2000 O·cm and with TCR from -1.7 to -3.2 %/K. NiO x thin film were deposited with resistivity from 1 to 300 O·cm and with TCR from -2.2 to -3.3 %/K. The thermal stability of these films was also investigated. It was found that biased target ion beam deposited high TCR MoOx and NiOx thin films are polycrystalline semiconductors and have good stability in air. Compared to commonly used VOx thin films, MoOx or NiOx thin films may offer improved process control for resistive temperature sensors and a superior deposition rate. However, preliminary experiments indicate that these films might have relatively higher 1/f noise.
机译:氧化钒(VOx)薄膜是用于红外热像仪的商用非冷却焦平面阵列中最常见的成像层。这些VOx薄膜的x值介于1.3到2之间,并且具有低电阻率(0.1到10 O·cm),高电阻温度系数(TCR)(--2到--3%/ K)和低1 / f噪音。反应离子束溅射通常用于沉积这些VOx薄膜,用于商用热成像相机。然而,据报道,用于VOx的反应性离子束沉积系统的通量不足,并且工艺窗口狭窄。在这项工作中,研究了用于微辐射热计应用的纳米复合VOx薄膜的反应性脉冲直流磁控溅射的潜力。通过反应性溅射从金属钒靶材在具有衬底偏置的氩气/氧气混合物中沉积电阻率为10 -4至105 O·cm的VOx薄膜,TCR为0至-4.3%/ K。磁控溅射VOx的辐射热测量性能可与商业级IBD制备的VOx媲美。评价了反应性磁控溅射的制造实施中的重要限制,例如钒靶表面的磁滞氧化和不均匀氧化。 VOx膜的沉积速率,电阻率和电阻温度系数与氧气与氩气的比例,处理压力,目标到基板的距离以及氧气入口位置相关。为了以良好的均匀性和工艺控制来沉积电阻率范围为0.1--10 O·cm的VOx,发现较低的工艺压力,较大的靶到基板距离以及靠近基板的氧气入口是有用的。研究了其他采用磁控溅射的处理方法,例如V和V2O5靶材的共溅射,从VC靶材,V2O5靶材和V2Ox靶材进行溅射,但是对这些方法的初步研究并没有比简单的溅射方法产生更好的工艺。研究了另一种技术,即偏压靶离子束沉积(BTIBD),用于沉积可能添加合金的VOx薄膜。在此BTIBD系统中,能量远低于25 eV的离子产生了,并且钒靶材独立地受到负偏压以进行溅射。通过使用残留气体分析仪实时控制氧分压,可在103-104 O·cm的电阻率范围内可再现地制备高TCR(<-4.5%/ K)VOx薄膜。这些高电阻率的薄膜可用于下一代非冷却焦平面阵列,而不是横向热敏电阻。这种架构可以通过较高的TCR来提高灵敏度,而不会增加通常伴随较高电阻的噪声。讨论了生产高TCR VOx膜所需的工艺参数,以及有关这种新型沉积工具如何工作的细节。还研究了钼的添加及其对VOx薄膜电学性能的影响。使用BTIBD系统,难以生产目前微辐射热测量应用所需的电阻率在0.1-10 O·cm的VOx膜。通过反应性偏置目标离子束沉积来沉积纯氧化钼(MoOx)和氧化镍(NiOx)薄膜,并进行评估,以寻找具有更大工艺自由度的材料。沉积的MoOx薄膜的电阻率为3至2000 O·cm,TCR为-1.7至-3.2%/ K。沉积的NiO x薄膜的电阻率为1至300 O·cm,TCR为-2.2至-3.3%/ K。还研究了这些膜的热稳定性。已经发现,偏置靶离子束沉积的高TCR MoOx和NiOx薄膜是多晶半导体,并且在空气中具有良好的稳定性。与常用的VOx薄膜相比,MoOx或NiOx薄膜可以为电阻温度传感器提供更好的工艺控制,并具有出众的沉积速率。但是,初步实验表明,这些薄膜可能具有相对较高的1 / f噪声。

著录项

  • 作者

    Jin, Yao.;

  • 作者单位

    The Pennsylvania State University.;

  • 授予单位 The Pennsylvania State University.;
  • 学科 Mechanical engineering.
  • 学位 Ph.D.
  • 年度 2014
  • 页码 151 p.
  • 总页数 151
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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