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MECHANISMS OF ANODIC BONDING.

机译:阳极键合机理。

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摘要

The mechanisms of formation of anodic bonds between glasses and metals are examined. Prior workers have suggested electrochemical, electrostatic, and thermal mechanisms for bond formation, but the dominant mechanism has not been clearly defined. The process is found to be an electrochemical analog to thermal glass-to-metal seals, where the metal surface is oxidized into the glass due to the development of large electric fields across the anodic depletion layer.;While Joule heating of the depletion layer has been suggested important, a detailed heat transfer model and the experimental data indicate that the temperature increase during bonding is insufficient to cause appreciable interfacial softening. Heat is generated both in the bulk glass and in the depletion layer.;The means of uniting irregular surfaces are discussed. Coverage of local defects is possible by densification of the depletion layer and dissolution of anodic protrusions. Elastic and plastic deformation are important for uniting smooth surfaces. A model for viscous flow is proposed, which indicates that viscous flow is less important than previously proposed.;The electrochemical model for anodic bonding is consistent with prior studies of bonding and glass polarization, the experimental and theoretical results of this study, and the interfacial structure requirements for thermal seals. Electrostatic attraction and thermal softening mechanisms are inconsistent with the aggregate data. The electrochemical situation is unusual due to the properties of glass as an electrolyte: transient polarization processes are important, the anodic reaction is irreversible, the mobilities of ions involved in the reactions are vastly different, and the depletion layer structure is quite different from that of the bulk material.;The transient current response at constant potential is examined experimentally and modelled with an equivalent circuit. The results indicate that many ions are moving within a charge-neutral depletion layer, the anodic process is the limiting electrode reaction, and the rate of polarization is governed by the glass resistance. Kinetic data from prior studies are analyzed and support a model where the bonding kinetics are governed by the glass resistivity.
机译:研究了玻璃与金属之间形成阳极键的机理。先前的工作人员已经提出了用于键形成的电化学,静电和热机制,但是尚未明确定义主要机制。发现该过程与热玻璃-金属密封的电化学模拟相似,在该过程中,由于在阳极耗尽层上形成了较大的电场,因此金属表面被氧化成玻璃。认为重要的是,详细的传热模型和实验数据表明,粘结过程中的温度升高不足以引起明显的界面软化。大块玻璃和耗尽层中都会产生热量。讨论了将不规则表面结合在一起的方法。通过耗尽层的致密化和阳极突起的溶解,可以覆盖局部缺陷。弹性和塑性变形对于组合光滑表面很重要。提出了一种黏性流动模型,该模型表明黏性流动没有以前提出的重要。阳极键合的电化学模型与键合和玻璃极化的先前研究,本研究的实验和理论结果以及界面一致。热封的结构要求。静电吸引和热软化机制与汇总数据不一致。由于玻璃作为电解质的性质,电化学情况不寻常:瞬态极化过程很重要,阳极反应不可逆,反应中涉及的离子迁移率有很大不同,耗尽层结构与实验研究了恒定电位下的瞬态电流响应,并用等效电路建模。结果表明,许多离子在电荷中性耗尽层中移动,阳极过程是极限电极反应,极化速率受玻璃电阻控制。分析了来自先前研究的动力学数据,并支持了其中粘合动力学受玻璃电阻率控制的模型。

著录项

  • 作者

    ALBAUGH, KEVIN BRUCE.;

  • 作者单位

    Clarkson University.;

  • 授予单位 Clarkson University.;
  • 学科 Engineering Chemical.
  • 学位 Ph.D.
  • 年度 1987
  • 页码 251 p.
  • 总页数 251
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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