Redesign of the Micro400 Line Driver: Transition from through-hole to surface mount technology.

摘要

everal design alternatives were developed, evaluated, and compared for the Micro400 Line Driver, an electronic communication device manufactured by Novatek Inc, located in Caguas, Puerto Rico. The main objective was to provide design alternatives that would reduce costs while implementing electronic advanced assembly technologies such as Surface Mount Technology (SMT). The design alternatives were developed using a Computer Aided Design software package. Several aspects of the design were evaluated, such as component cost, manufacturing implications, and Printed Circuit Board Design (PCB). In addition to the current design, which is a 100% Through-Hole Technology (THT) product, five alternatives were generated. These new alternatives presented several practical combinations for both SMT and THT components. In developing the alternatives, the required manufacturing process and Novatek's manufacturing capabilities were taken into consideration. The design alternatives were compared using a factor analysis. The factors focused issues such as manufacturing implications, costs, and design/quality parameters. The recommended alternative is a hybrid SMT-THT design. It includes through-hole mechanical components such as a connector, a terminal block, a DPDT switch, and electronic components such as electrolytic capacitors. A prototype was developed and tested using Novatek's facilities. The results obtained from these prototypes were excellent and the product can be implemented in Novatek, after minor modifications have been completed. This design with combined technology offers annual savings of