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Micro- and nano-scale surface adhesion and contact mechanics studies.

机译:微米和纳米级表面粘附力和接触力学研究。

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摘要

The strong adherence (stiction) of adjacent surfaces is a major design concern in microelectromechanical systems (MEMS). Analysis of the different stiction micro-mechanisms and the elastic and elastic-plastic deformation of asperities at MEMS interfaces is developed using two- and three-dimensional fractal descriptions of surface topography which are scale-invariant. Expressions for the elastic and plastic components of the normal contact force and real contact area are derived in terms of fractal parameters, material properties, and mean surface separation distance. The influence of surface roughness, relative humidity, applied voltage, and material properties on the magnitude of the van der Waals, electrostatic, and capillary forces is analyzed in light of simulation results. It is shown that the effects of surface roughness and applied voltage on the maximum stiction force are significantly more pronounced than that of material properties. Results for the critical pull-off stiffness versus surface roughness are presented for different material properties and microstructure stand-free surface spacing.; Single and repeated indentation of dynamic face-centered-cubic (fcc) Lennard-Jones (LJ) and metallic substrates by rigid tips are investigated using three-dimensional molecular dynamics (MD) simulations. Force hysteresis is observed in each indentation loading-unloading cycle. The generation of a step dislocation in a L-J solid is revealed by a single atom indentation simulation. Results show that the compressive yield strength, elastic unloading stiffness, and energy dissipation decrease with increasing substrate equilibrium temperature and decreasing indentation speed. The significance of the interfacial atomic potential and tip shape on the deformation behavior is elucidated by comparing results for copper indented by a blunt fcc copper tip and a sharp hydrogen-terminated diamond tip. The formation of a connective neck during unloading is observed for the copper-copper system but not for the diamond-copper system due to the stronger interatomic forces and larger tip area in the former system. Results for copper and silver substrates repeatedly indented by a hydrogen-terminated diamond tip up to a fixed depth or maximum normal force are presented in order to illustrate the evolution of deformation and heating in the substrate with indentation cycles. Behaviors resembling cyclic hardening and softening are revealed in the MD studies.
机译:相邻表面的强附着力(静摩擦力)是微机电系统(MEMS)中的主要设计关注点。利用表面形貌的二维和三维分形描述,对尺度不变的不同静力微观机制以及凹凸的弹性和弹塑性变形进行了分析。根据分形参数,材料特性和平均表面分离距离,得出法向接触力和实际接触面积的弹性和塑性分量的表达式。根据仿真结果,分析了表面粗糙度,相对湿度,施加的电压和材料特性对范德华力,静电力和毛细作用力的影响。结果表明,表面粗糙度和施加电压对最大静摩擦力的影响要明显大于材料性能。给出了不同材料性能和微观结构无支撑表面间距的临界剥离刚度对表面粗糙度的结果。使用三维分子动力学(MD)模拟研究了通过刚性尖端对动态面心立方(fcc)Lennard-Jones(LJ)和金属基材进行的单次重复压痕。在每个压痕装卸循环中都观察到了力滞。 L-J固体中台阶位错的生成通过单原子压痕模拟得以揭示。结果表明,抗压屈服强度,弹性卸载刚度和能量耗散随着基底平衡温度的升高和压痕速度的降低而降低。通过比较钝的fcc铜尖和尖锐的氢封端的金刚石尖所压入的铜的结果,阐明了界面原子电势和尖形对变形行为的重要性。对于铜-铜系统,观察到在卸载过程中形成连接颈部,但对于金刚石-铜系统,则观察不到,这是由于前者系统中较强的原子间力和较大的尖端面积。给出了用氢封端的金刚石尖端反复压痕到固定深度或最大法向力的铜和银基材的结果,以说明随着压痕循环而变形和加热的过程。 MD研究揭示了类似于循环硬化和软化的行为。

著录项

  • 作者

    Yan, Wentao.;

  • 作者单位

    University of California, Berkeley.;

  • 授予单位 University of California, Berkeley.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 1997
  • 页码 168 p.
  • 总页数 168
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业 ;
  • 关键词

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