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Adaptive fuzzy control of temperatures in a semiconductor processing furnace.

机译:半导体加工炉中温度的自适应模糊控制。

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The ability to control temperatures in semiconductor processing furnaces is critical to the manufacturing of semiconductor devices. Temperature control is made difficult by certain characteristics of furnaces: nonlinearity, long time constants, actuator saturation and asymmetry, and a large operating temperature range. In addition, the controller must perform well in response to large disturbances that occur when a cold wafer load is first inserted into the furnace as well as handling small disturbances that may occur in steady state. In this work, a general approach to fuzzy control is developed that takes these characteristics into account and provides significant performance advantages when compared to a linear controller.; Because of the long time constants and high operating costs of semiconductor processing furnaces, simulation is essential. A computationally efficient lumped heat capacitance model was developed to simulate the dominant center zone of a vertical furnace. Although it is not exact, the model is shown to be accurate enough to use for controller development and was used throughout this work to design and evaluate prototype control strategies.; A commonly used approach to fuzzy control was found to be unsuitable for use with the furnace. Large steady-state errors were produced by the combination of nonlinear gains with the proportional control action internal to the fuzzy controller, and were eliminated by using a modified fuzzy PI controller. Integrator windup was eliminated by incorporating its prevention into the membership functions and rule base. When used with nonlinear or asymmetric response characteristics, the resulting fuzzy PI controller is shown to have a unique capability to obtain best-case performance in response to both large and small disturbances using a single set of controller parameters.; Fuzzy gain scheduling was applied to both a linear PI controller and an asymmetric fuzzy PI controller. A single gain scheduler improved the performance of the linear controller at high temperatures and stabilized the system at low temperatures. Gain-scheduled fuzzy controllers were able to produce optimum performance at a desired stabilization temperature plus substantially improved performance for both large and small steps when operated hands-off over a 400-1000{dollar}spcirc{dollar}C temperature range.
机译:在半导体加工炉中控制温度的能力对于半导体器件的制造至关重要。炉子的某些特性使温度控制变得困难:非线性,长时间常数,执行器饱和度和不对称性以及较大的工作温度范围。另外,控制器必须响应于将冷晶片负载首次插入炉中时发生的大干扰,以及应对可能在稳态下发生的小干扰而表现良好。在这项工作中,开发了一种通用的模糊控制方法,该方法考虑了这些特性,并且与线性控制器相比具有明显的性能优势。由于半导体加工炉的长时间常数和高运营成本,因此进行仿真至关重要。建立了计算有效的集总热容模型,以模拟立式炉的主要中心区域。尽管并不精确,但该模型已被证明足够精确,可用于控制器开发,并且在整个工作中都用于设计和评估原型控制策略。发现一种常用的模糊控制方法不适用于熔炉。非线性增益与模糊控制器内部的比例控制动作相结合会产生较大的稳态误差,并通过使用改进的模糊PI控制器加以消除。通过将其预防措施纳入成员职能和规则库中,消除了集成商结束。当与非线性或非对称响应特性一起使用时,所显示的模糊PI控制器具有独特的能力,可以使用一组控制器参数来响应大型和小型干扰而获得最佳性能。模糊增益调度同时应用于线性PI控制器和非对称模糊PI控制器。单个增益调度器提高了线性控制器在高温下的性能,并在低温下稳定了系统。增益调度的模糊控制器能够在所需的稳定温度下产生最佳性能,并且在400-1000℃的温度范围内进行手动操作时,无论大步还是小步,都能显着提高性能。

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