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Improved current -gain cutoff frequency and high gain -bandwidth amplifiers in transferred -substrate HBT technology.

机译:转移衬底HBT技术中改进的电流增益截止频率和高增益带宽放大器。

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摘要

The transferred-substrate HBT technology developed at UCSB has demonstrated the ability to realize extremely high bandwidth bipolar transistors. Record values of fmax over 1 THz have been attained, promising levels of performance in distributed and tuned amplifier circuitry far beyond the current state of the art. In order to fabricate fast digital circuitry as well as analog circuitry of more conventional topologies, it is absolutely necessary to have simultaneously high f tau as well as fmax. It is of paramount importance to improve the ftau figure of merit in transferred-substrate HBTs via improved MBE growth of the HBT semiconductor, bandgap engineering techniques, and lateral as well as vertical scaling of the transistor structure. An ftau of 275 GHz has been achieved in transferred---substrate HBT technology; this is the highest ftau achieved to date for a bipolar transistor.;The high fmax values achieved at UCSB so far are the result of aggressive lithographic scaling of the collector dimension and space---charge screening effects in the collector (capacitance cancellation). Achieving high ftau is more difficult. To minimize the various components of the HBT forward delay (proportional to the inverse of ftau) quickly requires a combination of lithographic scaling, reduction of contact and access resistances, and reduction of parasitic layout capacitances.;Development of the basic HBT technology has continued in this work. A gas carbon source is now operational in the MBE system, and is able to dope the bases of future HBTs well into the 1020/cm3 range without worry of dopant diffusion. A phosphorous source also has been installed in the MBE system and will soon be operational, giving transferred-substrate HBTs improvement in breakdown voltage and hence output power performance.;This work also demonstrates the highest gain-bandwidth single-stage amplifiers, implemented in the common-collector, common-emitter configuration. These wide bandwidth amplifiers have very low power consumption of tens of milliwatts, and are further evidence of the frequency performance of transferred substrate HBTs.
机译:UCSB开发的转移衬底HBT技术证明了实现极高带宽双极晶体管的能力。已经获得了超过1 THz的fmax记录值,有望在分布式和调谐放大器电路中达到远远超出现有技术水平的性能水平。为了制造更常规拓扑的快速数字电路和模拟电路,绝对必须同时具有高f tau和fmax。至关重要的是,通过改善HBT半导体的MBE生长,带隙工程技术以及晶体管结构的横向和纵向缩放,来改善转移衬底HBT的ftau品质因数。转移的衬底HBT技术已达到275 GHz的英尺。这是迄今为止双极晶体管的最高ftau值。到目前为止,UCSB的fmax值很高,这是集电极尺寸和集电极中空间电荷屏蔽效应(电容消除)的激进光刻缩放的结果。实现高ftau更加困难。为了最大程度地减小HBT正向延迟的各个分量(与ftau的倒数成正比),需要结合光刻缩放,减小接触电阻和访问电阻以及减小寄生布局电容的方法。这项工作。气体碳源现已在MBE系统中运行,并且能够将未来HBT的基础掺杂到1020 / cm3的范围内,而不必担心掺杂剂扩散。 MBE系统中还安装了磷源,磷源将很快投入使用,从而改善了转移衬底HBT的击穿电压,从而改善了输出功率性能。这项工作还展示了在增益放大器中实现的最高增益带宽单级放大器。公共收集器,公共发射器配置。这些宽带放大器具有几十毫瓦的极低功耗,并且进一步证明了转移的衬底HBT的频率性能。

著录项

  • 作者

    Mensa, Dino Lamonte.;

  • 作者单位

    University of California, Santa Barbara.;

  • 授予单位 University of California, Santa Barbara.;
  • 学科 Electrical engineering.
  • 学位 Ph.D.
  • 年度 1999
  • 页码 154 p.
  • 总页数 154
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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