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Estimating and mitigating radiated emissions from PCB heatsinks.

机译:估计并减轻PCB散热器的辐射。

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摘要

The advance of VLSI technology requires heatsinks to take away the heat generated by ICs and keep the temperature below an acceptable limit. These metal heatsinks radiate and cause EMI problems when electromagnetic noises are coupled to them. Thus it is important to study the possible radiation of a VLSI heatsink and the effective methods to reduce the radiated emissions.;This dissertation includes three chapters on estimating and mitigating VLSI heatsink radiation. In the first chapter, a closed-form expression is derived for determining the maximum possible radiated emissions from a heatsink over a printed circuit board or chassis plane as a function of the maximum voltage between the heatsink and plane. The relevant parameters are the dimensions of the heatsink. The closed-form expression is validated by comparing its results to full-wave simulation results. This analysis was done for rectangular heatsinks, but the results can be applied to other heatsink shapes.;The second chapter discusses a method to damp the unintended radiated emissions from PCB-chassis (or heatsink-PCB) resonances with lossy posts mounted near the four corners of the rectangular cavity formed. A simple closed-form expression was derived for determining an optimal series resistance for damping these cavity resonances over a wide range of frequencies. A similar analysis could be done to determine the optimal resistance values for other cavity shapes and mounting post locations. For the 4-post configuration, shorting one or more of the posts does not affect the optimum resistance value for the remaining posts.;The third chapter discusses the reduction of a tall heatsink radiation by using shorting posts that bypass some of the noise current to the PCB ground. At high frequencies, the size of a tall heatsink may be comparable to a quarter-wavelength and the heatsink/board geometry can be an efficient antenna. The effectiveness of shorting posts was examined for reducing heatsink radiation. The use of lossy components for damping LC resonances is also discussed.
机译:VLSI技术的进步要求散热片带走IC产生的热量,并使温度保持在可接受的极限以下。当电磁噪声耦合到它们时,这些金属散热器会辐射并引起EMI问题。因此研究VLSI散热器可能产生的辐射以及减少辐射的有效方法就显得尤为重要。本文共分三章,对估计和减轻VLSI散热器的辐射进行了研究。在第一章中,导出了一个封闭形式的表达式,用于确定散热器在印刷电路板或机箱平面上的最大可能辐射发射,该辐射取决于散热器和平面之间的最大电压。相关参数是散热器的尺寸。通过将封闭式表达式的结果与全波模拟结果进行比较,可以验证封闭式表达式的有效性。该分析是针对矩形散热器完成的,但其结果也可以应用于其他散热器形状。第二章讨论了一种阻尼PCB机箱(或散热器PCB)谐振产生的意外辐射的方法,该方法在四个附近安装了损耗柱矩形腔的四角形成。得出了一个简单的闭合形式表达式,用于确定在较大频率范围内阻尼这些谐振腔的最佳串联电阻。可以进行类似的分析来确定其他空腔形状和安装柱位置的最佳电阻值。对于4接点配置,短路一个或多个接点不会影响其余接点的最佳电阻值。;第三章讨论了通过使用绕过一些噪声电流的短路接点来减少较高的散热器辐射PCB接地。在高频下,高散热片的尺寸可能相当于四分之一波长,并且散热片/板的几何形状可以成为有效的天线。检查了短路柱对减少散热器辐射的有效性。还讨论了使用有损分量来衰减LC谐振。

著录项

  • 作者

    He, Xinbo.;

  • 作者单位

    Clemson University.;

  • 授予单位 Clemson University.;
  • 学科 Engineering Chemical.;Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2011
  • 页码 67 p.
  • 总页数 67
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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