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An investigation of the mechanical strength of nanocrystalline gold-silicon thin films.

机译:纳米晶金-硅薄膜的机械强度研究。

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摘要

A study on the effects of deposition rate and Si content on the mechanical and electrical properties of Au-Si films has been performed. Au-Si films were synthesized by electron beam evaporation on (100) Si substrates at the Center for Integrated Nanotechnologies at Los Alamos National Laboratory. The Au and Si were simultaneously codeposited to create films with a nominal thickness of 1 µm, with deposition rates from 10 Å/s to 60 Å/s and Si content up to 21 at. %. The films deposited at 10 Å/s were then investigated by transmission electron microscopy (TEM), selected area diffraction (SAD), and particle-induced X-ray emission (PIXE). All films were investigated by X-ray diffraction (XRD), atomic force microscopy (AFM), nanoindentation, and four point resistivity probe.;Nanotwinned Au grains were observed in the TEM images of the films deposited at 10 Å/s. In addition, Si nanoparticles were observed at the grain boundaries in the films containing 6 and 21 at. % Si deposited at 10 Å/s. Diffraction peaks associated with crystalline Si were not observed by SAD or XRD, which suggests the Si particles are amorphous.;The reduced elastic modulus was found to decrease with increasing Si content for films deposited at 10 Å/s and 40 Å/s. This is consistent with the shift observed by in the diffraction intensities of the (111) and (200) Au diffraction peaks. Pure Au films were observed to have a strong (111) preferred orientation, however increasing Si content corresponded to an increase in the intensity of the (200) Au diffraction peak relative to the (111) Au diffraction peak.;The hardness of the films was observed to increase with increasing Si content. Increases in measured hardness were shown to be described by a combination of the Hall-Petch relationship and Orowan strengthening. Grain size estimates from XRD results as well as TEM images were used to predict the strength of the films using the Hall-Petch relation. Electrical resistivity was observed to increase linearly with Si content.
机译:已经进行了沉积速率和Si含量对Au-Si膜的机械和电学性质的影响的研究。在Los Alamos国家实验室的集成纳米技术中心,通过电子束蒸发在(100)Si衬底上合成了Au-Si膜。同时共沉积Au和Si,以形成标称厚度为1 µm的薄膜,沉积速率为10Å/ s至60Å/ s,Si含量最高为21 at。 %。然后通过透射电子显微镜(TEM),选择区域衍射(SAD)和粒子诱导的X射线发射(PIXE)研究以10Å/ s沉积的薄膜。通过X射线衍射(XRD),原子力显微镜(AFM),纳米压痕和四点电阻率探针对所有薄膜进行了研究;在以10Å/ s沉积的薄膜的TEM图像中观察到未保留的金晶粒。另外,在含有6和21at。%的膜的晶界处观察到Si纳米颗粒。以10Å/ s沉积的%Si。 SAD或XRD均未观察到与结晶Si相关的衍射峰,这表明Si颗粒为非晶态。发现在10Å/ s和40Å/ s沉积的薄膜中,降低的弹性模量会随着Si含量的增加而降低。这与通过(111)和(200)Au衍射峰的衍射强度观察到的偏移一致。观察到纯Au薄膜具有很强的(111)优先取向,但是增加的Si含量对应于(200)Au衍射峰相对于(111)Au衍射峰的强度增加。观察到随着Si含量的增加而增加。霍尔-帕奇关系和Orowan强化相结合,说明了所测硬度的增加。 X射线衍射(XRD)结果和TEM图像得出的晶粒尺寸估计值通过霍尔-帕奇(Hall-Petch)关系用于预测薄膜强度。观察到电阻率随Si含量线性增加。

著录项

  • 作者

    Ford, Kyle Douglas.;

  • 作者单位

    Oklahoma State University.;

  • 授予单位 Oklahoma State University.;
  • 学科 Engineering Mechanical.;Engineering Materials Science.
  • 学位 M.S.
  • 年度 2012
  • 页码 76 p.
  • 总页数 76
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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