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Design-time and run-time frameworks for multi-objective optimization of 2D and 3D NoC-based multicore computing systems.

机译:用于基于2D和3D NoC的多核计算系统的多目标优化的设计时和运行时框架。

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摘要

As a result of semiconductor technology scaling persisting over the last five decades, chip designers are today faced with the task of managing over a billion on-chip transistors. With feature sizes of no more than a few tens of nanometers in contemporary technologies, several undesirable phenomena at such nanoscale geometries have significantly complicated System-on-Chip (SoC) design. These phenomena include: (i) an increased influence of process variations that has introduced considerable unpredictability in circuit-behavior; (ii) a lowering of the critical charge of logic- and memory-cells that has given rise to elevated levels of soft-errors; (iii) a steep rise in power-densities due to higher transistor-densities, that has introduced the problem of dark-silicon, where a significant portion of the chip is required to be shut down at any given time; (iv) circuit aging that has increased significantly because of higher severity of aging factors such as electromigration and bias temperature instability (BTI) in circuits fabricated in advanced technology nodes; and (v) high voltage drops in the power delivery network (PDN) that have worsened due to the shrinking widths of on-chip interconnects. Additionally, even though the design complexity has risen exponentially, the time-to-market window for design companies has not changed markedly. Despite the numerous daunting challenges faced by the semiconductor design community, each new generation of SoCs are expected to meet higher and higher performance demands. Therefore, there is an urgent need for holistic automated system-level design tools that produce feasible and optimized design solutions efficiently while satisfying application and platform constraints.;As a lot more transistors become available to designers with every new technology node, we are witnessing a trend of increasing number of processing cores on the semiconductor die. With tens to hundreds of cores being integrated on emerging multicore SoCs, network-on-chip (NoC) based communication architectures have been found to be more suitable compared to the traditional bus-based communication architectures. Also, the recently evolved paradigm of 3D stacking of ICs has opened up new avenues for extracting higher performance from future systems by stacking multiple layers of cores and memory. In this thesis, we propose design-time optimization frameworks for synthesis of 2D and 3D NoC-based multicore SoCs. We present novel algorithms and heuristics for application-mapping, voltage-island partitioning, and NoC routing path allocation to optimize metrics such as communication and computation power and energy, chip-cooling power, voltage-drops in the PDN, design-yield, and energy-delay-squared product (ED 2P), while satisfying temperature, PDN, and performance constraints. In addition, to address the critical need for system-level solutions that can simultaneously and adaptively manage the constraints imposed by dark silicon, process variations, soft-error reliability, and lifetime reliability, we propose run-time frameworks for OS-level adaptations based on the circuit-level characteristics of multicore SoCs. Experimental results show that the techniques proposed in this thesis produce design solutions that provide much better overall optimality while considering multiple optimization metrics pertinent to modern semiconductor design.
机译:在过去的五十年中,由于半导体技术的规模不断扩大,如今的芯片设计人员面临着管理超过十亿片上晶体管的任务。在当代技术中,特征尺寸不超过几十纳米,在这种纳米级几何结构上出现的一些不良现象使片上系统(SoC)设计大大复杂化。这些现象包括:(i)工艺变化的影响增加,在电路性能中引入了相当大的不可预测性; (ii)降低逻辑单元和存储单元的临界电荷,从而提高了软错误水平; (iii)由于较高的晶体管密度导致功率密度的急剧上升,这带来了深色硅的问题,其中在任何给定时间都需要关闭芯片的很大一部分; (iv)由于在先进技术节点中制造的电路中诸如电迁移和偏置温度不稳定性(BTI)等老化因素的严重性,电路老化已大大增加; (v)功率传输网络(PDN)中的高压降由于片上互连宽度的缩小而恶化。此外,即使设计复杂度呈指数增长,设计公司的上市时间窗口也没有明显改变。尽管半导体设计界面临着众多艰巨的挑战,但新一代的SoC有望满足越来越高的性能要求。因此,迫切需要整体自动化的系统级设计工具,这些工具可以在满足应用程序和平台约束的同时,有效地产生可行且优化的设计解决方案。随着越来越多的晶体管可供每个新技术节点的设计人员使用,我们正在目睹半导体芯片上处理核数量增加的趋势。随着数十到数百个内核集成在新兴的多核SoC上,与传统的基于总线的通信体系结构相比,基于片上网络(NoC)的通信体系结构被发现更为合适。而且,最近发展起来的3D集成电路堆叠范例为通过堆叠多层内核和存储器从未来系统中提取更高性能开辟了新途径。在本文中,我们提出了基于2D和3D NoC的多核SoC合成的设计时优化框架。我们为应用程序映射,电压岛分割和NoC路由路径分配提供了新颖的算法和启发式方法,以优化指标,例如通信和计算能力和能量,芯片冷却能力,PDN中的压降,设计良率和能量延迟平方乘积(ED 2P),同时满足温度,PDN和性能约束。此外,为了满足对系统级解决方案的迫切需求,该系统级解决方案可以同时并自适应地管理由深色硅,工艺变化,软错误可靠性和寿命可靠性带来的约束,我们提出了基于OS级适应的运行时框架多核SoC的电路级特性。实验结果表明,本文提出的技术能够提供设计方案,在考虑与现代半导体设计相关的多个优化指标的同时,提供更好的总体最优性。

著录项

  • 作者

    Kapadia, Nishit.;

  • 作者单位

    Colorado State University.;

  • 授予单位 Colorado State University.;
  • 学科 Computer engineering.;Computer science.
  • 学位 Ph.D.
  • 年度 2016
  • 页码 249 p.
  • 总页数 249
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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