首页> 外文学位 >A second generation GENEric SYstems Simulator (GENESYS) for a gigascale system-on-a-chip (SoC).
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A second generation GENEric SYstems Simulator (GENESYS) for a gigascale system-on-a-chip (SoC).

机译:第二代通用系统模拟器(GENESYS),用于千兆级片上系统(SoC)。

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摘要

Future opportunities for gigascale integration will be governed by a hierarchy of theoretical and practical limits that can be codified as follows: fundamental, material, device, circuit, and system. The exponential increase in on-chip integration is driving System-on-a-Chip (SoC) methodologies as a dominant solution for gigascale ICs. Therefore, a second generation generic systems simulator (GENESYS 2K4) is developed to address a need for rapid assessment of system performance metrics for billion-transistor systems-on-a-chip while maintaining the depth of core modeling codified in the hierarchy of limits. A newly developed system methodology incorporates a hierarchical block-based model, a dual interconnect distribution, a generic on-chip bus model, and cell placement algorithms. A comparison of simulation results for five commercial chip implementations shows increased accuracy in projecting die size, clock frequency, and power dissipation. ITRS projections for future technology requirements are applied with results indicating that increasing static power dissipation is a key impediment to continued advances in chip performance. Additionally, simulations of a generic chip multi-processor architecture utilizing several interconnect schemes shows that the most promising candidate for the future of on-chip global interconnect networks will be hierarchical bus structures providing a high degree of connectivity while maintaining high operating frequencies.
机译:千亿级集成的未来机会将由理论和实践限制的层次结构决定,这些层次可以被编纂为以下内容:基础,材料,设备,电路和系统。片上集成的指数级增长正在推动片上系统(SoC)方法成为千兆级IC的主要解决方案。因此,开发了第二代通用系统仿真器(GENESYS 2K4),以解决对十亿个晶体管片上系统的系统性能指标进行快速评估的需求,同时保持已编入极限层次结构的核心建模的深度。新开发的系统方法结合了基于分层块的模型,双互连分布,通用的片上总线模型和单元放置算法。对五个商用芯片实现的仿真结果进行比较,结果表明,在投影芯片尺寸,时钟频率和功耗方面,精度得到了提高。应用ITRS对未来技术要求的预测,结果表明增加的静态功耗是芯片性能不断提高的关键障碍。此外,利用几种互连方案对通用芯片多处理器体系结构的仿真表明,未来片上全球互连网络最有前途的候选者将是分层总线结构,该总线结构可在保持高工作频率的同时提供高度的连接性。

著录项

  • 作者

    Nugent, Steven P.;

  • 作者单位

    Georgia Institute of Technology.;

  • 授予单位 Georgia Institute of Technology.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2005
  • 页码 199 p.
  • 总页数 199
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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