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On-chip manipulation and controlled assembly of colloidal particles using alternating electric fields.

机译:使用交变电场对胶体颗粒进行芯片控制和组装。

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Alternating (AC) electric fields have been investigated as a versatile tool for rapid particle and fluid manipulation in micro-Total Analysis Systems (muTAS). Different onchip electrode geometries and different particle suspensions were explored in this study with an aim to acquire a fundamental understanding of particle behavior under applied fields. Aqueous suspensions of particles of sizes ranging from nanoparticles to microspheres and having varied electrical properties (dielectric or conductive) were studied. For each system, detailed electrostatic simulations were carried out to identify the forces acting on the particles and fluid. Control of the particle-field, fluid-field and particle-particle interactions, by fine tuning the applied field, lead to the desired assembly of particles. Dielectrophoresis (DEP), the interaction between induced particle dipoles and the spatially non-uniform electric field, was used to assemble gold nanoparticles into microwires and for manipulating fluid droplets containing suspended particles in a novel liquid-liquid microfluidic system. AC Electrohydrodynamics (EHD) driven liquid flows were used for the transportation, redistribution and collection of suspended particles inside experimental cells.; Suspensions of metallic nanoparticles in water were assembled via DEP into wires of micrometer thickness between planar electrodes. Two modes of microwire assembly, one through the bulk of the suspension, and one as half-cylinders on the glass surface between the electrodes were identified. The operating conditions responsible for the two assembly modes were recognized. Control of the process parameters allowed making, for example, straight single connectors, or massively parallel arrays of microwires on the surface of the chip. The direction of microwire growth was guided by introducing conductive islands or particles in the suspension. The microwire assembly process was modeled using finite element electrostatic calculations. The experiments, supported by electrostatic calculations, showed that the wires grew in the direction of highest field intensity, "automatically" making electrical connections to the objects between the electrodes. The results point the way to controlled dielectrophoretic assembly of nanoparticles into on-chip electrical connectors, switches and networks.; A new EHD effect arising from the application of alternating electric fields to patterned electrode surfaces was observed. (Abstract shortened by UMI.)
机译:交流(AC)电场已被研究为在微型总分析系统(muTAS)中进行快速粒子和流体处理的通用工具。在这项研究中探索了不同的片上电极几何形状和不同的颗粒悬浮液,旨在获得对应用领域中颗粒行为的基本了解。研究了大小从纳米颗粒到微球的颗粒,具有不同的电性能(介电或导电)的水悬浮液。对于每个系统,都进行了详细的静电模拟,以识别作用在颗粒和流体上的力。通过微调所施加的场来控制粒子场,流场和粒子-粒子之间的相互作用,可以实现所需的粒子组装。介电电泳(DEP)是感应粒子偶极子与空间不均匀电场之间的相互作用,用于将金纳米粒子组装成微丝,并用于在新型液-液微流体系统中处理包含悬浮粒子的液滴。交流电流体动力学(EHD)驱动的液体流用于实验细胞内部悬浮颗粒的运输,再分布和收集。水中的金属纳米颗粒悬浮液通过DEP组装成平面电极之间微米级的金属丝。确定了两种模式的微丝组装,一种通过悬浮液,另一种作为电极之间玻璃表面上的半圆柱体。确认了负责两种组装模式的工作条件。通过控制工艺参数,可以在芯片表面上制作例如直的单个连接器或微丝的大规模平行阵列。通过在悬浮液中引入导电岛或微粒来指导微丝生长的方向。使用有限元静电计算对微线组装过程进行建模。由静电计算支持的实验表明,导线沿最高场强的方向生长,“自动”与电极之间的物体形成电连接。结果指出了控制纳米颗粒介电电泳组装到片上电连接器,开关和网络的方法。观察到由在图案化的电极表面上施加交变电场而产生的新的EHD效应。 (摘要由UMI缩短。)

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