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Interfacial instabilities during the solidification of a pure material from its melt.

机译:纯材料从其熔体凝固过程中的界面不稳定性。

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Solidification of materials is important in the semiconductor and electronics industry. It is ordinarily required that crystals grown industrially have uniform mechanical and electrical properties to ensure better quality and reproducibility of the final devices that are produced from them. Thus there is a considerable economic incentive in producing uniform crystals. However, the occurrence of morphological defects at the growing solidification interface arising from growth instabilities leads to undesirable electro-mechanical properties of such crystals. It is the goal of this work to thoroughly understand the physics and causes of morphological instability in solidification.; Inasmuch as the problem of morphological instability of a solid-liquid interface has been considered in the past, many questions remain unanswered. Of central interest is the pattern that evolves when an instability occurs. To begin to answer this question one begins to address the earlier question of what the magnitude of the wavelength of the initial instability might be. My research focuses on this earlier issue. And a set of questions begin to present themselves. They are: What is the reason for the instability at a solid-liquid interface? When does the instability set in? How can one explain the dependence of roughness growth rate on its wave number? Why is a maximum growth rate seen in problems like precipitation and solidification? What happens after the instability sets in? Does the front speed up or slow down compared to its predicted base value? Why are cellular patterns observed in solidification whereas precipitation is incapable of giving anything as interesting? Can one determine the nature of the branching to the non-planar steady state in the post-onset regime? Many important findings have been made in the course of answering these questions.; The primary discoveries of this work are: First, the shapes of the disturbance growth curves in solidification require the effect of transverse heat diffusion for their explanation. The neutral curves in solidification are found to give rise to the possibility of a cellular pattern at the onset of instability whereas for other solid-liquid front growth problems independent of thermal transport, such as precipitation from a supersaturated solution or electrodeposition of a metal from an ionic electrolyte, the onset of an instability from a planar state leads to a single crest and trough. Second and more important, a solid-liquid front that grows on account of temperature gradients is the only one amongst all solid-liquid front growth problems where a critical wavelength, independent of surface energy, can occur. This critical wavelength is of the order of the size of the container in which the growth takes place and as such is the only critical point with which fluid convection can interact. Third, a solidification front always demonstrates a "speed-up" upon becoming unstable, which is to say that it always moves ahead of its predicted base value. This is in contrast with other solid-liquid growth instability problems like precipitation. Finally the nature of the bifurcation in a solid-liquid growth problem where growth occurs on account of thermal gradients may be a forward pitchfork, leading to cellular growth, or a backward pitchfork, leading to dendritic growth. This stands in contrast to other growth problems where the post onset region is ordinarily characterized by dendritic growth.
机译:材料的固化在半导体和电子工业中很重要。通常需要工业上生长的晶体具有均匀的机械和电性能,以确保由其生产的最终装置的更好的质量和可再现性。因此,在生产均匀晶体方面有相当大的经济动机。然而,由生长不稳定性引起的在生长的固化界面处的形态缺陷的出现导致这种晶体的不希望的机电性能。这项工作的目的是彻底了解凝固过程中的物理原因和形貌不稳定性的原因。由于过去已经考虑了固液界面的形态不稳定性问题,所以许多问题仍未得到解答。引起人们关注的是不稳定发生时演变的模式。为了开始回答这个问题,人们开始解决较早的问题,即初始不稳定性的波长大小是多少。我的研究集中在这个较早的问题上。然后出现了一系列问题。它们是:固液界面不稳定的原因是什么?不稳定何时会出现?如何解释粗糙度增长率对其波数的依赖性?为什么在沉淀和凝固等问题中看到最大增长率?不稳定开始后会发生什么?相对于其预测的基础值,前部是否会加快或减速?为什么在固化过程中观察到细胞模式,而沉淀却无法提供任何有趣的东西?是否可以确定发病后机制中分支到非平面稳态的性质?在回答这些问题的过程中已经取得了许多重要的发现。这项工作的主要发现是:首先,凝固过程中扰动增长曲线的形状需要横向热扩散的影响来解释。发现凝固过程中的中性曲线会在不稳定性开始时产生细胞型的可能性,而对于其他与热传递无关的固液前沿生长问题,例如过饱和溶液中的沉淀或金属的电沉积。离子电解质,从平面状态开始出现不稳定性会导致单个波峰和波谷。其次,更重要的是,由于温度梯度而增长的固液前沿是所有固液前沿增长问题中唯一可能出现临界波长而与表面能无关的问题之一。该临界波长约为发生生长的容器的大小,因此是流体对流可以相互作用的唯一临界点。第三,凝固前沿在变得不稳定时总是显示出“加速”,这就是说,凝固前沿总是在其预测基值之前移动。这与诸如沉淀的其他固液生长不稳定性问题相反。最后,由于热梯度而发生生长的固液生长问题中的分叉性质可能是导致细胞生长的前叉,或导致树突生长的后叉。这与其他生长问题相反,在其他生长问题中,发病后区域通常以树突状生长为特征。

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