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Glass cutting optimization with pump-probe microscopy and Bessel beam profiles

机译:利用泵浦探针显微镜和贝塞尔光束轮廓优化玻璃切割

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摘要

The processing of transparent materials by ultrashort pulses has opened diverse promising and fast-growing application areas such as the cutting of glasses for consumer electronics. One of the major benefits is the precise energy deposition, which may result in local weakening of the glass and hence defines a preferential direction for the separation path. Due to the vast variety of possible uses for different displays, research in this field is needed for more complex shapes and glasses of various thicknesses. Bessel-Gaussian beams with their elongated, thin focus profile and self-healing nature are an excellent fit, even for glasses up to several millimeters. Additional development to more complex beam profiles allows precise tailoring with respect to the mandatory specifications of the cutting process such as process speed or the realization of inner contours. One concept for the latter is the use of tilted Bessel-Gaussian beams to achieve both high quality and easy separation. Further approaches include the usage of higher-order Bessel beams or modified Gauss-Bessel beams. We employ digital holographic techniques to create the various profiles with the desired absorption distribution. Traditional microscopes fail to characterize these sensible changes in the interaction region, since they are limited to visualize permanent changes (ex situ) of the glass structure only. We take advantage of pump-probe microscopy to receive concise recordings of the extinction mechanisms of the beam-material-interaction. With both, high temporal and spatial resolution of in-situ diagnostics we gain access to the entire process window which enables us to develop optimized processing parameters for high-quality glass cuttings.
机译:通过超短脉冲对透明材料进行处理已打开了各种有前途且快速增长的应用领域,例如切割用于消费电子产品的玻璃。主要优点之一是精确的能量沉积,这可能会导致玻璃局部变弱,从而为分离路径确定了优先方向。由于不同显示器可能用途广泛,因此需要对这一领域进行研究,以制作更复杂的形状和各种厚度的眼镜。贝塞尔高斯光束具有细长的聚焦轮廓和自愈特性,即使对于几毫米以下的眼镜也非常适合。对更复杂的光束轮廓的进一步开发允许根据切割过程的强制性规范(例如过程速度或内部轮廓的实现)进行精确剪裁。后者的一个概念是使用倾斜的Bessel-Gaussian光束来实现高质量和易于分离。其他方法包括使用更高阶的贝塞尔光束或改进的高斯贝塞尔光束。我们采用数字全息技术来创建具有所需吸收分布的各种轮廓。传统显微镜无法描述相互作用区域中的这些明显变化,因为它们仅限于可视化玻璃结构的永久变化(非原位)。我们利用泵浦探针显微镜接收束与材料相互作用的消光机理的简明记录。凭借现场诊断的高时间和空间分辨率,我们可以访问整个过程窗口,这使我们能够开发出用于高质量玻璃切割的优化处理参数。

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  • 来源
  • 会议地点 San Francisco(US)
  • 作者单位

    TRUMPF Laser und Systemtechnik, Johann-Maus-Str. 2, 71254 Ditzingen, Germany,Institute of Applied Physics, Abbe Center of Photonics, Friedrich Schiller University Jena, Albert-Einstein-Strasse 15, 07745 Jena, Germany;

    TRUMPF Laser und Systemtechnik, Johann-Maus-Str. 2, 71254 Ditzingen, Germany;

    TRUMPF Laser und Systemtechnik, Johann-Maus-Str. 2, 71254 Ditzingen, Germany;

    TRUMPF Laser GmbH, Aichhalder Str. 39, 78713 Schramberg, Germany;

    TRUMPF Laser und Systemtechnik, Johann-Maus-Str. 2, 71254 Ditzingen, Germany,Chair for Laser Technology, Technical University Aachen, Steinbachstr. 15, 52074 Aachen,Germany;

    TRUMPF Laser und Systemtechnik, Johann-Maus-Str. 2, 71254 Ditzingen, Germany;

    Institute of Applied Physics, Abbe Center of Photonics, Friedrich Schiller University Jena, Albert-Einstein-Strasse 15, 07745 Jena, Germany;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Ultra-short pulse; laser materials processing; beam shaping; pump-probe;

    机译:超短脉冲;激光材料加工;光束整形泵浦探头;

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