EXPERIMENTAL STUDY ON MICROASSEMBLY BY USING LIQUID SURFACE TENSION

摘要

Microassembly using water drop was studied experimentally. The relation between the drop sizes and the water volume stored inside the nozzle was examined. The conditions in which the formed drops become hemispherical have been clarified. In picking up with a hemispherical drop, misalignment allowable for successful picking up was 65% of the geometrical limit L_(max) in the case of the chip resistance "0402", and 95% of L_(max) in the case of spherical object.