A new process for the preparation of polyimide/silica hybrid films

摘要

In this article a new process was introduced to prepare a series of transparent Pi/silica hybrid films. The mechanical properties at 77 K were studied and compared with the films prepared by the traditional process. It was shown that the tensile strength of the films prepared by the new process were superior to the films prepared by the traditional process. The morphology of the films was characterized by scanning electron microscopy (SEM) observation.