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Sintering behavior of ultrafineanocrystalline W/Cu composite powders synthesized by sol-spray drying and subsequent hydrogen reduction process

机译:溶胶-喷雾干燥及随后的氢还原工艺合成的超细/纳米晶钨/铜复合粉的烧结行为

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Ultrafine particle with nanocrystalline W-10 wt.%Cu and W-20 wt.%Cu composite powders were synthesized by sol-spray drying and hydrogen reduction processes. The sintering densification and microstructure evolution of these powders were investigated. The results showed that significant densification occurred at the sintering temperature ranging from 1000℃ to 1200℃, which was dependent on the copper content. For the W-20Cu compacts, 96.4% of the theoretical density could be realized when sintered at 1200℃ for 60min. Nevertheless, W-10Cu compacts could obtain only 90% of the theoretical density even though the sintering temperature was elevated to 1300℃ for 60min. This indicated that a low copper content was unfavorable for sintering densification of W-Cu powder. When the sintering temperature was further increased to 1420℃ and the holding time was prolonged to 90min, the relative density of the W-20Cu and W-10 Cu compacts reached 99.1%. In the range of 1100~1420℃, the activation energy of sintering densification for W-20Cu and W-10Cu decreased with increasing sintering temperature. There is no obvious grain growth when the sintering temperature was below 1200℃, whereas rapid grain coarsening occurred when the sintering temperature was above 1300℃, companying with obvious grain spheroidizing. In addition, the grain coarsening at 1420℃ was in good agreement with the Ostwald mechanism and the calculated kinetic coefficients of grain coarsening for W-10Cu and W-20Cu were about 0.067μm~3/min and 0.026μm~3/min, respectively.
机译:通过溶胶-喷雾干燥和氢还原工艺合成了具有W-10 wt。%Cu和W-20 wt。%Cu复合粉末的纳米晶体超细颗粒。研究了这些粉末的烧结致密化和组织演变。结果表明,在1000℃〜1200℃的烧结温度下发生明显的致密化,这取决于铜的含量。对于W-20Cu压块,在1200℃烧结60min时可实现理论密度的96.4%。然而,即使将烧结温度提高到1300℃60分钟,W-10Cu压坯也只能获得理论密度的90%。这表明低的铜含量不利于W-Cu粉末的烧结致密化。当烧结温度进一步提高到1420℃,保温时间延长到90min时,W-20Cu和W-10 Cu压坯的相对密度达到99.1%。在1100〜1420℃范围内,随着烧结温度的升高,W-20Cu和W-10Cu的烧结致密化活化能降低。烧结温度低于1200℃时,没有明显的晶粒长大;而烧结温度高于1300℃时,则出现了快速的晶粒粗大化,并伴有明显的球化现象。另外,在1420℃下晶粒粗化与Ostwald机理吻合良好,W-10Cu和W-20Cu的晶粒粗化动力学系数分别约为0.067μm〜3 / min和0.026μm〜3 / min。 。

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