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InP optoelectronic devices and photonic integrated circuits for high-speed packet switching

机译：用于高速数据包交换的InP光电设备和光子集成电路

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Abstract: Packet switching architectures which exploit the optical space switching stage are presented. Possible components for the implementation of the photonic space stage are InP devices. The paper discusses the basic principles of semiconductor optical switches and reviews the latest state of the art results on switches and monolithic space switching matrices. !48

机译：摘要：提出了利用光空间交换级的分组交换架构。 InP设备是实现光子级空间的可能组件。本文讨论了半导体光开关的基本原理，并回顾了有关开关和单片空间开关矩阵的最新技术成果。！48

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来源
《Topical Meeting on Photonic Switching》|1992年|p.295-306|共12页
会议地点 Minsk(BY);Minsk(BY)
作者
Marko Erman; Alcatel Alsthom Recherche; Marcoussis; France.;
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原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
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专利

1. Enabling Tb/s Photonic Routing: Development of Advanced Hybrid Integrated Photonic Devices to Realize High-Speed, All-Optical Packet Switching [J] . Stampoulidis L., Apostolopoulos D., Petrantonakis D., IEEE journal of selected topics in quantum electronics . 2008,第3期

机译：启用Tb / s光子路由：先进的混合集成光子设备的开发，以实现高速全光分组交换
2. The BOOM Project: Towards 160 Gb/s Packet Switching Using SOI Photonic Integrated Circuits and Hybrid Integrated Optical Flip-Flops [J] . Stamatiadis C., Gomez-Agis F., Stampoulidis L., Lightwave Technology, Journal of . 2012,第1期

机译：BOOM项目：使用SOI光子集成电路和混合集成光触发器实现160 Gb / s分组交换
3. Monolithically integrated photonic and optoelectronic circuits based on InP-system applications, technology, perspectives [J] . H. Heidrich Microsystem technologies . 2003,第5期

机译：基于InP系统应用，技术和观点的单片集成光子和光电电路
4. InP optoelectronic devices and photonic integrated circuits for high-speed packet switching [C] . Marko Erman Topical meeting on photonic switching . 1993

机译：INP光电器件和光子集成电路用于高速分组交换
5. Design, fabrication and characterization of N-channel InGaAsP-InP based inversion channel technology devices (ICT) for optoelectronic integrated circuits (OEIC): Double heterojunction optoelectronic switches (DOES), heterojunction field-effect transistors (HFET), bipolar inversion channel field-effect transistors (BICFET) and bipolar inversion channel phototransistors (BICPT). [D] . Tan, Eugene. 1998

机译：基于N沟道InGaAsP-InP的倒置通道技术器件（ICT）的设计，制造和表征，用于光电集成电路（OEIC）：双异质结光电开关（DOES），异质结场效应晶体管（HFET），双极倒置沟道场-效应晶体管（BICFET）和双极型反向沟道光电晶体管（BICPT）。
6. Wireless Data Transmission at Terahertz Carrier Waves Generated from a Hybrid InP-Polymer Dual Tunable DBR Laser Photonic Integrated Circuit [O] . Guillermo Carpintero, Shintaro Hisatake, David de Felipe, -1

机译：混合InP聚合物双可调DBR激光光子集成电路产生的太赫兹载波无线数据传输
7. The BOOM project: towards 160 Gb/s packet switching using SOI photonic integrated circuits and hybrid integrated optical flip-flops [O] . Stamatiadis, C, Gomez Agis, F Fausto, Stampoulidis, L, 2012

机译：BOOM项目：使用SOI光子集成电路和混合集成光触发器实现160 Gb / s分组交换

InP optoelectronic devices and photonic integrated circuits for high-speed packet switching

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