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PHASE SELECTION IN UNIDIRECTIONAL GROWTH OF Sn-Ag_3Sn EUTECTIC ALLOY

机译:Sn-Ag_3Sn共晶合金单向生长的相选择

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The Sn-Ag_3Sn eutectic alloy is one of the candidates for lead-free solders. The solidified structure of this eutectic system is complex. To understand the coupled zone of this alloy, unidirectional solidification experiments have been carried out. At lower growth velocity, eutectic interface appears. On the other hand, Sn-dendrite appears as a primary phase at higher growth velocity. The distance between the dendrite tip and following eutectic interface (ΔL) are measured with varying the growth velocity (V). ΔL, increases rapidly near the transition velocity from eutectic to Sn-dendrite interface with increasing V. ΔL remains constant at higher growth velocity, which indicates that the temperature difference between Sn-dendrite tip and eutectic interface is almost constant, even though both interface temperatures are function of V.
机译:Sn-Ag_3Sn共晶合金是无铅焊料的候选材料之一。该共晶系统的凝固结构是复杂的。为了理解这种合金的耦合区,已经进行了单向凝固实验。在较低的生长速度下,出现共晶界面。另一方面,Sn-枝晶以较高的生长速度显示为主相。通过改变生长速度(V)来测量枝晶尖端和随后的共晶界面之间的距离(ΔL)。随着V的增加,ΔL在从共晶界面到Sn-枝晶界面的转变速度附近迅速增加。在更高的生长速度下,ΔL保持恒定,这表明即使两个界面温度,Sn-枝晶尖端与共晶界面之间的温差也几乎恒定。是V的函数。

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