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Epitaxial growth and resistance of ag on Si(111)4x1-In surfaces

机译:Si(111)4x1-In表面上ag的外延生长和电阻

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We monitored the RHEED pattern continuously during Ag deposition on Si(111)4x1-In surface phase at RT and 155 K. At the initial stage of deposition at RT, the reflection spots of three-dimensional Ag particles appear at about 0.3 ML. The RHEED pattern after deposition of 15 ML of AG on Si(111)4x1-In surface phase shows spots corresponding to epitaxial soilver layer only. We also observed that with increasing deposited Ag thickness the both normal and extra 4x1 spots fade simultaneously at approximately similar rates. The present RHEED results indicate that 4x1 structure is stable with respect to the silver interaction at initial stage of deposition. During LT silver deposition we observed similar processes. In this case due to lower mobility of the Ag atoms the continuously epitaxial silver film is formed at earlier stage after deposition 3 ML of Ag.
机译:我们在RT和155 K下在Si(111)4x1-In表面相上进行Ag沉积期间连续监测RHEED图案。在RT沉积的初始阶段,三维Ag粒子的反射点出现在约0.3 ML处。在Si(111)4x1-In表面相上沉积15 ML AG后的RHEED图案仅显示对应于外延土壤层的斑点。我们还观察到,随着沉积Ag厚度的增加,正常的和额外的4x1点同时以近似相似的速率消失。目前的RHEED结果表明,相对于沉积初期的银相互作用,4x1结构是稳定的。在LT银沉积过程中,我们观察到了类似的过程。在这种情况下,由于Ag原子的迁移率较低,所以在沉积3ML的Ag之后的较早阶段形成连续的外延银膜。

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