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Improve the Charge Stability of SiO_2 Films by Plasma Treatment and Ion Implantation

机译:通过等离子体处理和离子注入提高SiO_2薄膜的电荷稳定性

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The plasma surface treatment and ion implantation are utilized to improve the stability of charge storage of the SiO_2 film electret. The effects are obviously different when the different kinds of plasma are used, and when the ions with different energy and dose implanted into the SiO_2 film. To the plasma treatment, the best effect is obtained with argon plasma. After argon plasma treatment with the arcing at 700V and 15 minutes for the SiO_2 film electret, its charge storage has a similar stability as one after the chemical surface modification. To the ion implantation method, the remanent surface potential is 95% of primary one after ion implantation by Ar~+ with a energy of 150KeV and a dose of 2E11/cm~2. The experimental results show that argon plasma treatment and Ar~+ implantation change the hydrophilicity of the surface of SiO_2 film and prevent the electret charge from leaking, which is owning to the increase of the surface conductance by the vapor adherence on the surface. In addition, the plasma bombardment and ion implantation induce traps into the near-surface, which make the trapped charge stored stable.
机译:等离子体表面处理和离子注入被用来提高SiO_2薄膜驻极体电荷存储的稳定性。当使用不同种类的等离子体,以及将具有不同能量和剂量的离子注入SiO_2薄膜时,效果明显不同。对于等离子体处理,使用氩等离子体可获得最佳效果。对SiO_2薄膜驻极体进行700V电弧放电和15分钟的氩气等离子体处理后,其电荷存储具有与化学表面改性后的电荷存储类似的稳定性。对于离子注入方法,在以150KeV的能量和2E11 / cm〜2的剂量通过Ar〜+进行离子注入之后,剩余表面电势为初生的剩余表面电势的95%。实验结果表明,氩气等离子体处理和Ar〜+注入改变了SiO_2膜表面的亲水性,并防止驻极体电荷泄漏,这归因于表面上的蒸汽附着而增加了表面电导。此外,等离子轰击和离子注入会导致陷阱进入近表面,从而使捕获的电荷稳定存储。

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