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Optimized Inductor and Low-Pass Filter with Low Substrate Loss on OPS/PS Interlayer

机译:经过优化的电感器和低通滤波器,在OPS / PS中间层上具有低基板损耗

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Oxidized porous silicon/porous silicon (OPS/PS) has been introduced as a low-loss substrate for an on-chip LC low-pass filter (LPF). The LPF is optimally designed with midband insertion loss (MIL) of -4.5dB and nominal cutoff frequency at 900MHz. The fabrication of the LPF based OPS/PS is in prevailing CMOS process. Experiments show that the performance of the LPF has been greatly unproved with MIL of -4.54dB that meets the designed value quite well. And in comparison with MIL of LPF on SiO_2/Si (8 Ω • cm), MIL with the proposed interlayer is lowered by 8dB, which implies that the microwave loss resulting from the substrate part can be substantially suppressed by introducing OPS/PS.
机译:氧化多孔硅/多孔硅(OPS / PS)已被引入作为片上LC低通滤波器(LPF)的低损耗基板。 LPF经过优化设计,中频带插入损耗(MIL)为-4.5dB,标称截止频率为900MHz。基于LPF的OPS / PS的制造正在流行的CMOS工艺中。实验表明,-4.54dB的MIL可以大大降低LPF的性能,可以很好地满足设计值。并且与SiO_2 / Si(8Ω•cm)上的LPF的MIL相比,具有建议的中间层的MIL降低了8dB,这意味着通过引入OPS / PS可以显着抑制由基板部分引起的微波损耗。

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