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Preparation and Characterization of 100-oriented diamond films by HFCVD

机译:HFCVD法制备100取向金刚石薄膜及其表征

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In this paper we report high quality [100]-oriented diamond films prepared by HFCVD using hydrogen as carrier gas and C_2H_5OH as carbon source for the first time. The surface morphology observed by SEM showed polycrystalline diamond films with [100] faced structure with an average grain size of ~20 μm. The Raman spectrum indicated sp~3 bonding with a sharp peak at 1333 cm~(-1).The Ⅰ-Ⅴ characteristics obtained via Au contact were determined by semiconductor characterization system. The electrical resistivity of HFCVD [100]-oriented diamond film was ~3.0x10~(10)Ω·cm. The capacitance and dielectric loss of films were very small with the value of 2.0pF and 0.02, respectively, and almost had no dependence with the change of frequency in high frequencies.
机译:在本文中,我们首次报道了以氢为载气,C_2H_5OH为碳源,通过HFCVD制备的高质量[100]取向金刚石薄膜。扫描电镜观察的表面形貌为[100]面结构的多晶金刚石膜,平均晶粒尺寸为〜20μm。拉曼光谱表明sp〜3键在1333 cm〜(-1)处有一个尖峰。通过半导体表征系统确定了通过Au接触获得的Ⅰ-Ⅴ特性。 HFCVD [100]取向金刚石薄膜的电阻率为〜3.0x10〜(10)Ω·cm。薄膜的电容和介电损耗很小,分别为2.0pF和0.02,在高频下几乎不受频率变化的影响。

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